Patents by Inventor Mizuki IJUIN

Mizuki IJUIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230079532
    Abstract: To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ? of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.
    Type: Application
    Filed: December 25, 2020
    Publication date: March 16, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Binti Haridan FATIN FARHANAH, Hiroyuki ABE, Takayuki YOGO, Nozomi YATSUMONJI, Mizuki IJUIN
  • Publication number: 20220390264
    Abstract: The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.
    Type: Application
    Filed: October 20, 2020
    Publication date: December 8, 2022
    Inventors: Takayuki YOGO, Binti Haridan FATIN FARHANAH, Akira UENODAN, Hiroyuki ABE, Mizuki IJUIN
  • Publication number: 20190371759
    Abstract: It is an object to provide a highly reliable physical-quantity measurement device which can relax thermal stress at a time of bonding and suppress creep or drift of a sensor output. To attain the above-described object, a physical-quantity measurement device according to the present invention includes a semiconductor element, and a base board connected to the semiconductor element with a plurality of layers being interposed. In the plurality of layers, a stress relaxing layer including at least metal as a main ingredient and a glass layer including glass as a main ingredient are formed each in a layered form including one or more layers. At least one of the stress relaxing layer and the glass layer includes low-melting-point glass, and a softening point of the low-melting-point glass is equal to or lower than the highest heat temperature that the semiconductor element can resist.
    Type: Application
    Filed: January 24, 2018
    Publication date: December 5, 2019
    Inventors: Takuya AOYAGI, Mizuki IJUIN, Daisuke TERADA, Hiroshi ONUKI, Shigenobu KOMATSU, Takashi NAITOU, Tatsuya MIYAKE