Abstract: An electronic apparatus includes a first chassis which loads a processing device, a second chassis which is coupled with the first chassis to be rotatably movable relative to each other and a vapor chamber which has a first flexile resin sheet, a second flexible resin sheet and a closed space which is formed between the first resin sheet and the second resin sheet and in which a working fluid is encapsulated, extends from the inside of the first chassis to the inside of the second chassis and transports heat that the processing device generates to the second chassis side.

Abstract: A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.