Abstract: To suppress thicknesses of a plating film of dies adjacent to a portion in which patterns are not formed on a resist, and improve uniformity of a plated metal layer thickness in a substrate surface. A substrate holder according to the present invention has: a holding surface 57 for holding a substrate; a second holding member 60 configured to have an opening part 63 for exposing the holding surface 57, and to press the substrate placed on the holding surface 57 against the holding surface 57 to thereby hold the substrate; and a shielding plate 65 configured to protrude to an inside of the opening part 63 of the second holding member 60 in a radial direction and to shield a part of the holding surface 57. The shielding plate 65 is configured to be movable along the opening part 63.

Abstract: There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate.

Abstract: The agitation of the plating solution may result in spattering of the plating solution. It have been found that the spattered plating solution can be attached even to portions that are not originally brought into contact with the plating solution in the plating apparatus. There is provided an electroplating apparatus for plating a substrate using a substrate holder, the electroplating apparatus comprising at least one bath for storing the substrate, the substrate holder being provided with a hanger shoulder, and a holder contact, and wherein the electroplating apparatus being provided with a cleaning/drying part provided on at least one side of the bath, the cleaning/drying part being provided for cleaning and/or drying at least one of the hanger shoulder, the holder contact and a contact provided to the bath.

Abstract: There is provided a method of supplying an indium ion to a plating solution for electrolytic plating using an insoluble anode. The method includes a step of preparing an acidic plating solution and a step of immersing indium metal in the plating solution and dissolving the indium metal in the plating solution without voltage application to the indium metal.

Abstract: A plating method capable of saving a substrate in an event of a failure of a transporter, a plating tank, or other component when the substrate is being plated is disclosed. The plating method includes: transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in the transporter or a post-processing tank; and replacing the plating solution in the plurality of plating tanks with a preservative liquid to thereby immerse the plurality of substrates in the preservative liquid.

Abstract: A plating apparatus 10 includes a rectifier 18 configured to apply a DC current to a substrate, and a plating apparatus control unit 30 that instructs the rectifier 18 on a value of the DC current. The plating apparatus control unit 30 has a setting unit 32 for setting a current value, a storage unit 34 that stores a relational expression between an instructed current value on which the rectifier 18 is instructed and an actual current value which the rectifier 18 outputs in accordance with the instructed current value, a calculation unit 38 that corrects the current value set by the setting unit 32 on the basis of the above-mentioned relational expression to calculate a corrected current value, and an instruction unit 36 that instructs the rectifier 18 on the corrected current value calculated by the calculation unit 38.

Abstract: A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. The substrate holder is able to hold a testing substrate for measurement of electric resistance of the substrate holder, and is configured such that the electric contact comes into contact with the testing substrate in a state where the testing substrate is held. The resistance measuring module includes: a test probe contactable with the testing substrate held in the substrate holder; and a resistance measuring instrument for measurement of a resistance value between the electric contact and the probe via the testing substrate.

Abstract: There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate.

Abstract: To suppress thicknesses of a plating film of dies adjacent to a portion in which patterns are not formed on a resist, and improve uniformity of a plated metal layer thickness in a substrate surface. A substrate holder according to the present invention has: a holding surface 57 for holding a substrate; a second holding member 60 configured to have an opening part 63 for exposing the holding surface 57, and to press the substrate placed on the holding surface 57 against the holding surface 57 to thereby hold the substrate; and a shielding plate 65 configured to protrude to an inside of the opening part 63 of the second holding member 60 in a radial direction and to shield a part of the holding surface 57. The shielding plate 65 is configured to be movable along the opening part 63.

Abstract: An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.

Abstract: A plating apparatus 10 includes a rectifier 18 configured to apply a DC current to a substrate, and a plating apparatus control unit 30 that instructs the rectifier 18 on a value of the DC current. The plating apparatus control unit 30 has a setting unit 32 for setting a current value, a storage unit 34 that stores a relational expression between an instructed current value on which the rectifier 18 is instructed and an actual current value which the rectifier 18 outputs in accordance with the instructed current value, a calculation unit 38 that corrects the current value set by the setting unit 32 on the basis of the above-mentioned relational expression to calculate a corrected current value, and an instruction unit 36 that instructs the rectifier 18 on the corrected current value calculated by the calculation unit 38.

Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

Abstract: An electroplating method is disclosed. The method includes preparing a substrate having via holes in a surface thereof, performing a pretreatment of the substrate surface by immersing the substrate in a pretreatment liquid containing a plating suppressor to adsorb the plating suppressor onto the substrate surface, immersing the pretreated substrate in a plating solution containing a plating suppressor and a plating accelerator to replace the pretreatment liquid, attached to the substrate surface including interior surfaces of the via holes, with the plating solution, and then electroplating the substrate surface to fill the via holes with metal.

Abstract: A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.

Abstract: A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.

Abstract: An electroplating method is capable of reliably embedding via holes with a plated metal such as copper or the like when a substrate with a seed layer of a metal having a greater ionization tendency than hydrogen is electroplated using an acidic plating solution such as a copper sulfate plating solution. The electroplating method including preparing a substrate having via holes covered with a first metal, which has a greater ionization tendency than hydrogen, in a surface thereof, pretreating the substrate by immersing the substrate in a pretreatment solution in which a second metal that is more noble than the first metal or a salt thereof is dissolved, and then electroplating the surface of the substrate to embed the second metal or a third metal in the via holes.

Abstract: An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.

Abstract: An electroplating method includes: preparing a substrate having via holes formed in a surface; immersing the substrate in a pretreatment solution to carry out pretreatment of the substrate; immersing the substrate in a plating solution without applying a voltage between the substrate and an anode, thereby replacing the pretreatment solution in the via holes with the plating solution; carrying out first-step electroplating of the substrate while controlling the voltage, applied between the substrate and the anode, to be equal to or higher than a voltage which is necessary for an electric current, appropriate to fill a plated metal into the via holes, to flow stably between the substrate and the anode; and carrying outsecond-step electroplating of the substrate while controlling the electric current, flowing between the substrate and the anode, at an electric current appropriate to fill the plated metal into the via holes.

Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.

Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.