Patents by Inventor Mizuki SHIGEMASA

Mizuki SHIGEMASA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230039669
    Abstract: Provided is a water-soluble film for molding a packaging capsule which is capable of enclosing chemical agents especially a detergent, has a robust property that prevents leakage of the detergent through suitable thickness and strength and an easy-processing property that keeps robustness not to make a drawn portion break in mold-processing such as deep drawing, further has a soluble resistance that does not make the chemical agent elute within 30 seconds in water at 20° C. and a complete-solubility property within a short period of time in dish-washing and clothes-washing, also has sufficient solubility and complete-solubility properties for film portions around the perimeter edge pasted with a water-soluble film for a top, and exhibits a strong-sealing property to have a temporal stability.
    Type: Application
    Filed: September 11, 2020
    Publication date: February 9, 2023
    Applicant: AICELLO CORPORATION
    Inventors: Mizuki SHIGEMASA, Ryo MURAMATSU, Hirokazu OHSAWA
  • Publication number: 20220081522
    Abstract: An object is to smoothly obtain, through coating of the surface of a metal roll, a polyvinyl alcohol-based resin film that contains a polyvinyl alcohol-based resin and can be used in a water sealing process, and/or to lower the adhesion force of such film on metal seal bar, etc., during heat sealing. As a solution, a polyvinyl alcohol-based resin film containing components A to C below is provided: A. a polyvinyl alcohol-based resin; B. a plasticizer; and C. one or more types selected from sodium polyoxyethylene alkyl ether acetate, disodium polyoxyethylene alkyl sulfosuccinate salt, N-alkyl-N-methyl-ß-alanine sodium salt, and sodium alkane-1,2-diol acetate salt.
    Type: Application
    Filed: October 10, 2019
    Publication date: March 17, 2022
    Inventors: Mizuki SHIGEMASA, Yohei KUCHINA, Hirokazu OHSAWA