Patents by Inventor Mladen Bumbulovic
Mladen Bumbulovic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9627244Abstract: Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions.Type: GrantFiled: December 19, 2003Date of Patent: April 18, 2017Assignee: Mattson Technology, Inc.Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere
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Publication number: 20160113061Abstract: A heat treatment apparatus for heat treating an interior surface of a longitudinally extending cavity of a target structure has a processing head which comprises a longitudinally extending central support member and distal and proximal end caps protruding laterally from the central support member. Each end cap has a plurality of apertures configured to respectively receive distal and proximal ends of elongated plasma arc lamps and position the plasma arc lamps to extend longitudinally along and laterally around the central support member such that radiation emitted collectively by the plasma arc lamps is directed generally radially outwards from the processing head. The processing head also comprises a coolant pathway having heat exchange zones in thermal communication with the plasma arc lamps and coolant supply and return conduits in fluid communication with the heat exchange zones.Type: ApplicationFiled: May 26, 2014Publication date: April 21, 2016Inventor: Mladen Bumbulovic
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Patent number: 9245730Abstract: An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of liquid along an inside surface of the envelope, first and second electrodes within the envelope configured to generate a plasma arc therebetween, and an insulative housing associated surrounding at least a portion of an electrical connection to one of the electrodes. The apparatus further includes a shielding system configured to block electromagnetic radiation emitted by the arc to prevent the electromagnetic radiation from striking all inner surfaces of the insulative housing. The apparatus further includes a cooling system configured to cool the shielding system.Type: GrantFiled: February 24, 2012Date of Patent: January 26, 2016Assignee: Mattson Technology, Inc.Inventors: Amar B. Kamdar, David Malcolm Camm, Mladen Bumbulovic, Peter Lembesis
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Publication number: 20150035436Abstract: An apparatus for generating electromagnetic radiation includes an envelope, a vortex generator configured to generate a vortexing flow of liquid along an inside surface of the envelope, first and second electrodes within the envelope configured to generate a plasma arc therebetween, and an insulative housing associated surrounding at least a portion of an electrical connection to one of the electrodes. The apparatus further includes a shielding system configured to block electromagnetic radiation emitted by the arc to prevent the electromagnetic radiation from striking all inner surfaces of the insulative housing. The apparatus further includes a cooling system configured to cool the shielding system.Type: ApplicationFiled: February 24, 2012Publication date: February 5, 2015Applicant: MATTSON TECHNOLOGY, INC.Inventors: Amar B. Kamdar, David Malcolm Camm, Mladen Bumbulovic, Peter Lembesis
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Publication number: 20140147600Abstract: An apparatus and method of coating and/or lining of the interior of pipes and tubular goods with a performance enhancing layer of metal alloy using a 360° radiant heat source. The use of the disclosed apparatus and methods facilitates the capability to metallurgically bond a layer of metal alloy or composite material to the interior of a steel pipe or similar metal based tubular good with a primary diameter ranging typically from 1.5? to 8?. The disclosed apparatus and methods are especially useful to produce piping used in the conveyance and/or transportation of hot, corrosive and/or abrasive fluids in the oil and gas, and mining Industries.Type: ApplicationFiled: November 26, 2013Publication date: May 29, 2014Inventors: John Dennis Neukirchen, Mladen Bumbulovic
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Patent number: 8454356Abstract: An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.Type: GrantFiled: November 15, 2007Date of Patent: June 4, 2013Assignee: Mattson Technology, Inc.Inventors: David Malcolm Camm, Joseph Cibere, Mladen Bumbulovic
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Patent number: 8434341Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.Type: GrantFiled: January 27, 2012Date of Patent: May 7, 2013Assignee: Mattson Technology, Inc.Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere
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Publication number: 20120118867Abstract: An apparatus for supporting a semiconductor workpiece includes a heating system configured to cause thermally-induced motion of the semiconductor workpiece by heating a surface of the workpiece relative to a bulk of the workpiece. The thermally-induced motion includes vertical motion of an outer edge region of the workpiece and a center of the workpiece relative to each other. The apparatus further includes a support system configured to allow the thermally-induced motion including the vertical motion of the outer edge region of the workpiece and the center of the workpiece relative to each other while supporting the workpiece.Type: ApplicationFiled: January 27, 2012Publication date: May 17, 2012Applicant: Mattson Technology Canada, Inc.Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere
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Patent number: 7501607Abstract: Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.Type: GrantFiled: December 20, 2004Date of Patent: March 10, 2009Assignee: Mattson Technology Canada, Inc.Inventors: David Malcolm Camm, Mladen Bumbulovic, Joseph Cibere, J. Kiefer Elliott, Steve McCoy, Greg Stuart
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Publication number: 20080157452Abstract: An apparatus for supporting a workpiece during heat-treating includes a support plate having a non-planar upper surface, and a support system. The support system is configured to support the workpiece above the support plate during heat-treating of the workpiece, such that a lower surface of an initial shape of the workpiece is supported at a non-uniform spacing above the non-planar upper surface of the support plate, said non-uniform spacing including an edge gap beneath an outer perimeter of the workpiece, and a central gap at a central axis of the workpiece.Type: ApplicationFiled: November 15, 2007Publication date: July 3, 2008Applicant: Mattson Technology Canada, Inc.Inventors: David Malcolm Camm, Joseph Cibere, Mladen Bumbulovic
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Publication number: 20050133167Abstract: Apparatuses and methods for suppressing thermally induced motion of a workpiece. An apparatus includes a workpiece heating system configured to thermally induce motion of a workpiece, and further includes a damping member spaced apart from the workpiece and configured to apply a damping force to dampen the motion of the workpiece. The damping member may be spaced apart from a rest position of the workpiece by a distance sufficiently small that gas pressure between the damping member and the workpiece opposes the motion of the workpiece. The distance is preferably adjustable.Type: ApplicationFiled: December 20, 2004Publication date: June 23, 2005Inventors: David Camm, Mladen Bumbulovic, Joseph Cibere, J. Elliott, Steve McCoy, Greg Stuart
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Publication number: 20040178553Abstract: Apparatuses and methods for supporting a workpiece such as a semiconductor wafer. A support system is configured to support the workpiece while allowing thermally-induced motion of the workpiece, which may include thermal bowing or thermal bending. The system may include a support member having a moveable engagement portion engageable with the workpiece, the engagement portion being moveable to allow the thermally-induced motion of the workpiece while supporting the workpiece. The moveable engagement portion may include a plurality of moveable engagement portions of a plurality of respective support members, which may be resiliently engageable with the workpiece. The support members may include flexible support members each having an unconstrained portion and a constrained portion, and the moveable engagement portions may include the unconstrained portions.Type: ApplicationFiled: December 19, 2003Publication date: September 16, 2004Inventors: David Malcolm Camm, Guillaume Sempere, Ljubomir Kaludjercic, Gregory Stuart, Mladen Bumbulovic, Tim Tran, Sergiy Dets, Tony Komasa, Marc Rudolph, Joseph Cibere