Abstract: An integrated circuit die has one or more through-body-vias and a testing circuit on board the die which tests for defects in a through-body-via by driving of pulses of current into a node. Pulses are counted until the voltage of the node reaches a threshold voltage to provide a pulse count which is a function of the capacitance of the node. A determination is made as to whether the through-body-via of the node has a defect as a function of the pulse count.

Abstract: Current tests for I/O interface connectors are described. In one example a test may include applying a forced energy to a first pin of an interface of a data communications bus of an integrated circuit on a die, sensing the energy caused by the forced energy at a second pin of the interface, and comparing the forced energy and the sensed energy to determine an amount of current leaked by at least a portion of the interface.

Abstract: In accordance with one aspect of the present description, an integrated circuit die has a plurality of through-body-vias and a testing circuit on board the die which allows charges on a first and second through-body-via to redistribute between them to provide an indication whether one or both of the first and second through-body-vias has a defect. Other aspects are described.

Abstract: In accordance with one aspect of the present description, an integrated circuit die has a one or more through-body-vias and a testing circuit on board the die which tests for defects in a through-body-via by driving of pulses of current into a node. Pulses are counted until the voltage of the node reaches a threshold voltage to provide a pulse count which is a function of the capacitance of the node. A determination is made as to whether the through-body-via of the node has a defect as a function of the pulse count. Other aspects are described.

Abstract: In accordance with one aspect of the present description, an integrated circuit die has a plurality of through-body-vias and a testing circuit on board the die which allows charges on a first and second through-body-via to redistribute between them to provide an indication whether one or both of the first and second through-body-vias has a defect. Other aspects are described.

Abstract: Current tests for I/O interface connectors are described. In one example a test may include applying a forced energy to a first pin of an interface of a data communications bus of an integrated circuit on a die, sensing the energy caused by the forced energy at a second pin of the interface, and comparing the forced energy and the sensed energy to determine an amount of current leaked by at least a portion of the interface.

Abstract: A method and an apparatus to process read data return has been disclosed. In one embodiment, the method includes packing a cache line of each of a number of read data returns into one or more packets, splitting each of the one or more packets into a plurality of flits, and interleaving the plurality of flits of each of the plurality of read data returns. Other embodiments are described and claimed.