Patents by Inventor Mlng Sun

Mlng Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DFN semiconductor package having reduced electrical resistance
    Publication number: 20060145318
    Abstract: A DFN semiconductor package is disclosed. The package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.
    Type: Application
    Filed: June 10, 2005
    Publication date: July 6, 2006
    Inventors: Xiaotian Zhang, Kai Liu, Mlng Sun