Patents by Inventor Mo Bai

Mo Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190375489
    Abstract: A wing unit of an unmanned aerial vehicle includes a middle wing, an outer wing and a connecting device which includes a first connecting portion and a second connecting portion. One of the first connecting portion and the second connecting portion is fixed on the middle wing and the other one is fixed on the outer wing. The first connecting portion and the second connecting portion are detachably connected. The connecting device also includes a restricting device which enables the first connecting portion and the second connecting portion to be fixedly connected or be separated.
    Type: Application
    Filed: September 21, 2018
    Publication date: December 12, 2019
    Inventors: Mo BAI, Xiaobo DOU, Bingyin SONG
  • Patent number: 10292308
    Abstract: A fluid coupling mating apparatus and method. Included is at least one mating member for removably coupling with another mating member for allowing fluid to pass therebetween. A lock is movably coupled to the at least one mating member. Still yet, a holder is coupled to the lock for holding the lock in relation to the holder during at least a portion of the removable coupling of the at least one mating member with another mating member.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: May 14, 2019
    Assignee: Futurewei Technologies, Inc.
    Inventors: Mo Bai, Vadim Gektin
  • Patent number: 10117357
    Abstract: The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: October 30, 2018
    Assignee: FUTUREWEI TECHNOLOGIES, INC.
    Inventors: Mo Bai, Vadim Gektin
  • Patent number: 9813082
    Abstract: A heat spreader and a method for making a heat spreader are disclosed. In an embodiment the heat spreader includes an enclosure with a hollow core and a foam core located in the hollow core.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: November 7, 2017
    Assignee: FUTUREWEI TECHNOLOGIES, INC.
    Inventors: Mo Bai, Vadim Gektin
  • Publication number: 20170104500
    Abstract: A heat spreader and a method for making a heat spreader are disclosed. In an embodiment the heat spreader includes an enclosure with a hollow core and a foam core located in the hollow core.
    Type: Application
    Filed: October 8, 2015
    Publication date: April 13, 2017
    Inventors: Mo Bai, Vadim Gektin
  • Publication number: 20170030497
    Abstract: A fluid coupling mating apparatus and method are provided. Included is at least one mating member for removably coupling with another mating member for allowing fluid to pass therebetween. A lock is movably coupled to the at least one mating member. Still yet, a holder is coupled to the lock for holding the lock in relation to the holder during at least a portion of the removable coupling of the at least one mating member with another mating member.
    Type: Application
    Filed: July 28, 2015
    Publication date: February 2, 2017
    Applicant: FUTUREWEI TECHNOLOGIES, INC.
    Inventors: Mo Bai, Vadim Gektin
  • Publication number: 20170027083
    Abstract: The present disclosure relates to a cold plate and vapor chamber for conduction cooling of one or more printed circuit boards in a printed circuit board (PCB) enclosure. The cold plate may include a planar surface at an oblique angle relative to an axis along which the PCB assembly is inserted into the enclosure. The PCB assembly may include a vapor chamber having a complementary obliquely angled surface. The complementary angled surfaces of the cold plate and vapor chamber may exert forces against each other upon insertion of the printed circuit board assembly into the enclosure and contact between the cold plate and vapor chamber.
    Type: Application
    Filed: July 20, 2015
    Publication date: January 26, 2017
    Inventors: Mo Bai, Vadim Gektin