Patents by Inventor Modest Oprysko

Modest Oprysko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via and via landing structures for smoothing transitions in multi-layer substrates
    Patent number: 6992255
    Abstract: An integrated circuit arrangement or package includes a set of contact pads arranged in a pattern and a multi-layer conductive structure, which electrically connects the set of contact pads to at least one signal line. The conductive structure provides impedance matching between the pads and the at least one signal line.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: January 31, 2006
    Assignee: International Business Machines Corporation
    Inventors: Modest Oprysko, Lei Shan, Jeannine M. Trewhella
  • Via and via landing structures for smoothing transitions in multi-layer substrates
    Publication number: 20050011674
    Abstract: An integrated circuit arrangement or package includes a set of contact pads arranged in a pattern and a multi-layer conductive structure, which electrically connects the set of contact pads to at least one signal line. The conductive structure provides impedance matching between the pads and the at least one signal line.
    Type: Application
    Filed: July 16, 2003
    Publication date: January 20, 2005
    Inventors: Modest Oprysko, Lei Shan, Jeannine Trewhella