Abstract: Aspects of the disclosure relate to an apparatus including an opto-electrical probe card platform for wafer-level testing of optical micro-electro-mechanical-systems (MEMS) structures. The probe card platform includes an electrical probe card including alignment needles for aligning with an optical MEMS structure during testing thereof. The probe card platform further includes an optical head configured to direct input light to towards the optical MEMS structure through the electrical probe card and an optical positioner attached to the electrical probe card and configured to align the optical head. The apparatus may further include a camera and a processor configured to process at least one image obtained by the camera and to generate alignment assistance data to assist the optical positioner in aligning the optical head.