Patents by Inventor Mohac Tekmen

Mohac Tekmen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230149721
    Abstract: A method includes detecting, by an implantable medical device (IMD), attachment to the IMD of at least one implantable medical lead with at least one electrode; and triggering by the IMD, based on the detecting of the attachment to the IMD of the at least one medical lead, a device test sequence in which the IMD performs the following qualification tests over an evaluation period: detecting an impedance for at least one electrical path that includes the at least one electrode to determine a connection status of the IMD to the at least one electrode; and comparing EGM (electrogram) amplitudes of the patient over an EGM test period against a predetermined threshold.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 18, 2023
    Inventors: John C. Stroebel, Maureen E. Lybarger, Mohac Tekmen, Greggory R. Herr, John D. Golnitz, Kristen J. Cattin, Eric A. Schilling, Eric R. Williams, Teresa A. Whitman, Mikayle A Holm, Michelle M. Galarneau, Tara M. Treml, Derek W. Prusener
  • Patent number: 9126031
    Abstract: This disclosure provides a medical lead assembly that includes a lead body having a proximal end configured to couple to an implantable medical device and a distal end. The lead assembly further includes an electrode assembly located at the distal end of the lead body, the electrode assembly including a tip electrode, a conductive electrode shaft that is electrically coupled to the tip electrode and an energy dissipating structure that is coupled to at least a portion of the conductive electrode shaft at high frequencies to redirect at least a portion of the current induced in the lead by a high frequency signal from the tip electrode to the energy dissipating structure.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: September 8, 2015
    Assignee: Medtronic, Inc.
    Inventors: Mohac Tekmen, Kevin R. Seifert
  • Publication number: 20110270369
    Abstract: This disclosure provides a medical lead assembly that includes a lead body having a proximal end configured to couple to an implantable medical device and a distal end. The lead assembly further includes an electrode assembly located at the distal end of the lead body, the electrode assembly including a tip electrode, a conductive electrode shaft that is electrically coupled to the tip electrode and an energy dissipating structure that is coupled to at least a portion of the conductive electrode shaft at high frequencies to redirect at least a portion of the current induced in the lead by a high frequency signal from the tip electrode to the energy dissipating structure.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 3, 2011
    Inventors: Mohac Tekmen, Kevin R. Seifert