Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: Modern modulator drivers must be capable of delivering a large output voltage into a tens of ohms modulator, while minimizing the amount of distortion added by the driver. The driver should deliver the output voltage without exceeding a maximum distortion while minimizing the DC power consumption. Accordingly, a modulator driver includes a final stage amplifier with auxiliary transistors that turn on when the conventional differential pair of transistors approaches their maximum voltage of the linear region of their transfer function, thereby providing a more linear transfer function, in particular at large input voltages.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: Modern modulator drivers must be capable of delivering a large output voltage into a tens of ohms modulator, while minimizing the amount of distortion added by the driver. The driver should deliver the output voltage without exceeding a maximum distortion while minimizing the DC power consumption. Accordingly, a modulator driver includes a final stage amplifier with auxiliary transistors that turn on when the conventional differential pair of transistors approaches their maximum voltage of the linear region of their transfer function, thereby providing a more linear transfer function, in particular at large input voltages.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: Modern modulator drivers must be capable of delivering a large output voltage into a tens of ohms modulator, while minimizing the amount of distortion added by the driver. The driver should deliver the output voltage without exceeding a maximum distortion while minimizing the DC power consumption. Accordingly, a modulator driver includes a final stage amplifier with auxiliary transistors that turn on when the conventional differential pair of transistors approaches their maximum voltage of the linear region of their transfer function, thereby providing a more linear transfer function, in particular at large input voltages.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: Embodiments of millimeter-wave antenna structures are generally described herein. The antenna structure may include an a radiating-element layer comprising a patterned conductive material, a ground layer comprising conductive material disposed on a dielectric substrate, and a feed-line layer comprising conductive material disposed on a dielectric substrate. In some embodiments, the antenna structure may include an air-gap layer disposed between the radiating-element layer and the ground layer. The air-gap layer may include spacing elements to separate the radiating-element layer and the ground layer by a predetermined distance. In some other embodiments, the radiating-element layer may be disposed on a radiating-element dielectric substrate which may include one or more cavities between the radiating-element layer and the ground layer.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages and devices, wherein a microelectronic package may be formed with an interposer with at least one microelectronic component attached to an active surface of the interposer, and at least one coaxial connector attached to an opposing attachment surface of the interposer. The microelectronic package may be attached to a substrate to form the microelectronic device, wherein the substrate includes an opening therethrough for access to the at least one coaxial connector.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: An integrated circuit package includes a substrate, first, second and third dies and an antenna. The substrate includes a first layer with electrical traces and a second layer substantially formed of a dielectric material. The first die includes a first integrated circuit. The second die includes a second integrated circuit electrically coupled through wire bonds to the integrated circuit on the substrate and mechanically coupled to the first die such that the first die is disposed between the substrate and the second die. The third die includes a third integrated circuit and is electrically coupled to the integrated circuit on the substrate. The antenna and the first, second and third integrated circuits substantially form a radio transceiver.

Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Abstract: According to an embodiment, a semiconductor die has a source bond pad and a destination bond pad attached to a top surface of the semiconductor die. A stud bump is situated on the destination bond pad. A bonding wire is then ball bonded to the source bond pad and thereafter stitch bonded to the stud bump on the destination bond pad. The bonding wire acts as an off-chip inductor or a portion of an off-chip inductor. In one embodiment a number of bonding-wires and on chip conductors are used to form an off-chip inductor. The inductance of the off-chip inductor can be adjusted or fine-tuned by adjusting a loop height of the one or more bonding wires used in the off-chip inductor. The inductance of the invention's off-chip inductor can also be adjusted by increasing or decreasing the number of bonding wires used to form the off-chip inductor.

Abstract: One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.