Patents by Inventor Mohamed Anwar Ali

Mohamed Anwar Ali has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STAGGERED SHIELD WIRES EXTENDING ALONG SUBSECTIONS OF SIGNAL WIRES
    Publication number: 20230245973
    Abstract: An electrical device for transporting electrical signals, wherein the electrical device comprises a plurality of signal wires each configured for transporting electrical signals, and a plurality of shield wires being staggered with respect to each other and each being configured for shielding signal wires with respect to each other, wherein each shield wire is arranged between a respective pair of signal wires and extends only along a subsection of each signal wire of the respective pair.
    Type: Application
    Filed: January 31, 2022
    Publication date: August 3, 2023
    Inventors: Mohamed Anwar Ali, James Robert Church, Sudersan Sampath, Roger A. Fratti
  • Extended HBM offsets in 2.5D interposers
    Patent number: 11538790
    Abstract: A semiconductor package includes an interposer, a number of a first integrated circuit (IC) dies, one or more second IC dies, and one or more dummy dies. The first IC dies, the second IC dies and the dummy dies are implemented on the interposer. The dummy dies are configured to enable routing of pins of the first IC dies to selected circuits of the second IC dies while conforming to predefined routing rules.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: December 27, 2022
    Assignee: BROADCOM INTERNATIONAL PTE. LTD.
    Inventors: Mohamed Anwar Ali, Thinh Quang Tran, Tauman T. Lau
  • EXTENDED HBM OFFSETS IN 2.5D INTERPOSERS
    Publication number: 20220302080
    Abstract: A semiconductor package includes an interposer, a number of a first integrated circuit (IC) dies, one or more second IC dies, and one or more dummy dies. The first IC dies, the second IC dies and the dummy dies are implemented on the interposer. The dummy dies are configured to enable routing of pins of the first IC dies to selected circuits of the second IC dies while conforming to predefined routing rules.
    Type: Application
    Filed: September 30, 2021
    Publication date: September 22, 2022
    Inventors: Mohamed Anwar Ali, Thinh Quang Tran, Tauman T. Lau