Patents by Inventor Mohamed Ashraf Mohd Arshad

Mohamed Ashraf Mohd Arshad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded power supply system having a thermally insulated component
    Patent number: 9141157
    Abstract: A molded system (100) has a plurality of components (110, 120, 130) attached to a carrier (101), one of the components being an object (110) of irregular thermal capacitance. For example, carrier (101) may be a QFN/SON-type leadframe and object (110) an inductor of high thermal capacitance. The surface of the object is sealed with a hardened polymeric layer (220) of high thermal resistance, whereby the layer (220) thermally insulates the object (110) and inhibits the transport of thermal energy between the object and the system. System (100) has molding compound (140) encapsulating the carrier and the attached components including the object (110) and the polymeric layer sealing the object's surface.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: September 22, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mohamed Ashraf Mohd Arshad, Jin Keong Lim
  • MOLDED POWER SUPPLY SYSTEM HAVING A THERMALLY INSULATED COMPONENT
    Publication number: 20150250063
    Abstract: A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.
    Type: Application
    Filed: May 15, 2015
    Publication date: September 3, 2015
    Inventors: Mohamed Ashraf Mohd Arshad, Jin Keong Lim
  • Molded Power Supply System Having a Thermally Insulated Component
    Publication number: 20130094169
    Abstract: A molded system (100) has a plurality of components (110, 120, 130) attached to a carrier (101), one of the components being an object (110) of irregular thermal capacitance. For example, carrier (101) may be a QFN/SON-type leadframe and object (110) an inductor of high thermal capacitance. The surface of the object is sealed with a hardened polymeric layer (220) of high thermal resistance, whereby the layer (220) thermally insulates the object (110) and inhibits the transport of thermal energy between the object and the system. System (100) has molding compound (140) encapsulating the carrier and the attached components including the object (110) and the polymeric layer sealing the object's surface.
    Type: Application
    Filed: October 13, 2011
    Publication date: April 18, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mohamed Ashraf Mohd Arshad, Jin Keong Lim