Abstract: A semiconductor detector device comprising: a detector element comprising at least one active detector layer of piezoelectric semiconductor material; a stress inducing element arranged to act in use on the detector element to generate therein a predetermined pattern of stress, and consequently a predetermined electrical field via the piezoelectric effect. A method of fabrication and of operation of a semiconductor detector device embodying these principles are also described.

Abstract: A semiconductor detector device comprising: a detector element comprising at least one active detector layer of piezoelectric semiconductor material; a stress inducing element arranged to act in use on the detector element to generate therein a predetermined pattern of stress, and consequently a predetermined electrical field via the piezoelectric effect. A method of fabrication and of operation of a semiconductor detector device embodying these principles are also described.

Abstract: A method of fabrication of electrical contact structures on a semiconductor material includes depositing an oxide of a desired contact material by a chemical electroless process on a face of the semiconductor material and reducing the oxide via a chemical electroless process to produce a contact of the desired contact material. A method of fabrication of a semiconductor device incorporating such electrical contact structures and a semiconductor device incorporating such electrical contact structures are also described.

Abstract: A method of fabrication of electrical contact structures on a semiconductor material is described comprising the steps of: depositing an oxide of a desired contact material by a chemical electroless process on a face of the semiconductor material; and reducing the oxide via a chemical electroless process to produce a contact of the desired contact material. A method of fabrication of a semiconductor device incorporating such electrical contact structures and a semiconductor device incorporating such electrical contact structures are also described.

Abstract: Methods for cleaning semiconductor processing chambers used to process carbon-containing films, such as amorphous carbon films, barrier films comprising silicon and carbon, and low dielectric constant films including silicon, oxygen, and carbon are provided. The methods include using a remote plasma source to generate reactive species that clean interior surfaces of a processing chamber in the absence of RF power in the chamber. The reactive species are generated from an oxygen-containing gas, such as O2, and/or a halogen-containing gas, such as NF3. An oxygen-based ashing process may also be used to remove carbon deposits from the interior surfaces of the chamber before the chamber is exposed to the reactive species from the remote plasma source.