Patents by Inventor Mohamed Belazzouz

Mohamed Belazzouz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lid edge capping load
    Patent number: 7733655
    Abstract: A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive.
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: June 8, 2010
    Assignee: International Business Machines Corporation
    Inventors: Martin Beaumier, Mohamed Belazzouz, Peter J Brofman, David L Edwards, Kamal K Sikka, Jiantao Zheng, Jeffrey A Zitz
  • LID EDGE CAPPING LOAD
    Publication number: 20100020503
    Abstract: A method attaches a semiconductor chip to a substrate, applies a thermal interface material to a top of the semiconductor chip, and positions a lid over the semiconductor chip typically attached to the substrate with an adhesive. The method applies a force near the distal ends of the lid or substrate to cause a center portion of the lid or substrate to bow away from the semiconductor chip and increases the central thickness of the thermal interface material prior to curing. While the center portion of the lid or substrate is bowed away from the semiconductor chip, the thermal interface material method increases the temperature of the assembly, thus curing the thermal interface material and lid adhesive.
    Type: Application
    Filed: July 22, 2008
    Publication date: January 28, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: MARTIN BEAUMIER, MOHAMED BELAZZOUZ, PETER J. BROFMAN, DAVID L. EDWARDS, KAMAL K. SIKKA, JIANTAO ZHENG, JEFFREY A. ZITZ