Abstract: Disclosed herein are viscoelastic elastomeric polyurethane foams, a process for preparing them and a method of using them in making shaped articles. Further disclosed herein are of viscoelastic elastomeric polyurethane foams having improved, unique impact absorption performance.

Abstract: Provided herein are composite materials comprising a layup consisting of one or more surfacing sheets comingled with a carbon fiber non-woven mat. The surfacing sheet may comprise polyamide-6 and the carbon fiber non-woven mat may comprise carbon fibers that have been recycled. The surfacing sheets comprise sub-micron scale particles for reducing the thermal expansion coefficient of the surfacing sheets. The resulting layup is suitable for use in the formation of articles, particularly articles requiring a smooth finish absent of defects caused by underlying surfaces having irregular compositions or textures.

Abstract: Described herein are a polyisocyanurate foam, its use in a sandwich panel, a sandwich panel including the foam, and a process for preparing the sandwich panel. The polyisocyanurate foam shows a good adhesion property even without adhesion promoter, improved processability of PIR systems at lower temperature (?50° C.), and an improved flame resistance property.

Abstract: A lignocellulosic article comprises a plurality of lignocellulosic pieces and a binding agent disposed on the plurality of lignocellulosic pieces. The binding agent is formed from a high temperature polymerization (HTP) polyol and an isocyanate component. A method of producing the lignocellulosic article is also disclosed.

Abstract: A method of producing the high molecular weight polycarbodiimide comprises the steps of providing an isocyanate component comprising toluene diisocyanate (TDI), a carbodiimidization catalyst, and a first solvent. The method further comprises the step of polymerizing the isocyanate component in the first solvent and in the presence of the carbodiimidization catalyst to produce a reaction mixture including at least one carbodiimide compound and the first solvent. In addition, the method comprises the step of combining a second solvent and the reaction mixture. Finally, the method comprises the step of polymerizing the at least one carbodiimide compound for a second period of time in the first and second solvents and in the presence of the carbodiimidization catalyst to produce the high molecular weight polycarbodiimide.

Abstract: A method of producing the high molecular weight polycarbodiimide comprises the steps of providing an isocyanate component comprising toluene diisocyanate (TDI), a carbodiimidization catalyst, and a first solvent. The method further comprises the step of polymerizing the isocyanate component in the first solvent and in the presence of the carbodiimidization catalyst to produce a reaction mixture including at least one carbodiimide compound and the first solvent. In addition, the method comprises the step of combining a second solvent and the reaction mixture. Finally, the method comprises the step of polymerizing the at least one carbodiimide compound for a second period of time in the first and second solvents and in the presence of the carbodiimidization catalyst to produce the high molecular weight polycarbodiimide.

Abstract: A coating composition comprises a high molecular weight polycarbodiimide. The high molecular weight polycarbodiimide is produced via a method. A method of preparing the coating composition and a method of forming a coating on a substrate with the coating composition are also disclosed.

Abstract: A lignocellulosic article comprises a plurality of lignocellulosic pieces and a binding agent disposed on the plurality of lignocellulosic pieces. The binding agent is formed from a high temperature polymerization (HTP) polyol and an isocyanate component. A method of producing the lignocellulosic article is also disclosed.

Abstract: A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder component and a tackifier component. The tackifier component comprises an acrylic or a styrene-butadiene polymer. The tackifier component is useful for maintaining orientation of the plurality of lignocellulosic pieces during manufacture of the composite article. The composite article may be various engineered lignocellulosic composites, such as particleboard.

Abstract: A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder component and a tackifier component. The tackifier component comprises a homo- and/or co-polymer of vinyl acetate. The tackifier component is useful for maintaining orientation of the plurality of lignocellulosic pieces during manufacture of the composite article. The composite article may be various engineered lignocellulosic composites, such as particleboard.

Abstract: A composite article comprises a plurality of lignocellulosic pieces and an adhesive system disposed on the plurality of lignocellulosic pieces for bonding the plurality of lignocellulosic pieces. The adhesive system comprises a binder component and a tackifier component. The tackifier component comprises a cationic polymer. The tackifier component is useful for maintaining orientation of the plurality of lignocellulosic pieces during manufacture of the composite article. The composite article may be various engineered lignocellulosic composites, such as particleboard.

Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Abstract: Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure: X—((CH2)m—(N)—((CH2)n-(Z))2)p wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C2H3O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/° C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240° C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.

Abstract: A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.

Abstract: A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.

Abstract: The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Abstract: Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure: X—((CH2)m—(N)—((CH2)n-(Z))2)p wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C2H3O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/° C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240° C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.

Abstract: Disclosed is a method for making a low CTE curable composition. In one embodiment, the method comprises mixing together (i) from 0.1 to 60.0% by weight of a nanoparticle composition and (ii) from 20.0 to 90.0% by weight of a curable binder to provide a premixture, based on the total weight of the premixture, and subjecting the premixture to high shear forces until the nanoparticle composition (i) is sufficiently dispersed in the curable binder (ii) to provide a curable composition. It has been found that the nanoparticle composition (i) must be at least one of (a) a strongly functionalized nanoparticle composition having no more than 25 mole % functionalization, (b) a weakly functionalized nanoparticle composition having from 1 to 100 mole % functionalization, (c) a nonfunctionalized nanoparticle composition, or (d) mixtures thereof.