Abstract: Thermally conductive materials comprising a non-polar elastomer, a polar elastomer, and a thermally conductive filler. The polar elastomer and non-polar elastomer are sufficiently immiscible to form a polar elastomer phase and a non-polar elastomer phase. The thermally conductive filler is concentrated in an amount of at least 60 volume percent of the total filler amount in either the non-polar elastomer phase or the polar elastomer phase. The thermally conductive material has a tensile modulus less than 200 MPa. Such thermally conductive materials can be employed in a variety of articles of manufacture as thermal interface materials.

Abstract: Polymeric compositions having a slip agent comprising a silicone and a fatty acid amide. Such polymeric compositions can exhibit lower coefficients of friction when compared to polymeric compositions containing either silicone or fatty acid amide alone. Such polymeric compositions are suitable for use in various articles of manufacture, including, for example, wire and cable jackets.

Abstract: Disclosed is a crosslinkable mixture comprising a polyolefin, an alkoxysilane, an organopolysiloxane, a free radical initiator and a liquid polymer modifier. The organopolysiloxane contains two or more hydroxyl end groups. When the crosslinkable mixture is melt-shaped, a unique crosslinked composition is formed. The liquid polymer modifier improves flexibility of the melt-shaped article without decreasing dielectric strength.

Abstract: A process for making a multilayered article, the process comprising the steps of: (A) Providing a mold comprising: (1) A mold housing comprising (a) at least one injection port, and (b) defining a mold cavity within which are positioned two deformable, pre-molded polymeric sheets; and (2) A removable, hollow core equipped with at least one vent, the removable, hollow core positioned between and space apart from the two polymeric sheets; (B) injecting under high pressure a viscous, crosslinkable, thermoplastic polymer into the mold cavity between the two polymeric sheets and around the removable core, (C) Drawing a vacuum on the mold cavity through both the vent in the mold housing and the vent in the removable, hollow core before, during and/or after the polymer has been injected into the mold; (D) Forming a less than fully cured multilayered article in the mold cavity; and (E) Removing the less than fully cured multilayer article from the mold cavity.

Abstract: A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one liquid epoxy resin; (b) at least one liquid cyclic anhydride hardener; (c) at least one thermally conducting and electrically insulating filler, wherein the filler includes an epoxy-silane treated filler; and (d) at least one cure catalyst with no amine hydrogens; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 120° C.

Abstract: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.

Abstract: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums comprise saturated medium chain triglycerides having fatty acid carbon chain lengths in the range of from 6 to 12 carbon atoms. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.

Abstract: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

Abstract: A wireless-communications-tower component being at least partially formed from a polymer composite. The polymer composite comprises a thermoplastic polymer and a filler, where the thermoplastic polymer is non-foamed. The polymer composite has a thermal conductivity of at least 0.5 watt per meter Kelvin (“W/m?K”) measured at 25 C. Such wireless-communications-tower components include radio frequency (“RF”) cavity filters, heat sinks, enclosures, and combinations thereof.

Abstract: A wireless-communications-tower component being at least partially formed from a foamed metal. The foamed metal has a density of less than 2.7 g/cm3, a thermal conductivity greater than 1 W/m·K, and a coefficient of thermal expansion of less than 30 ?m/m·K. Such a foamed metal can be an open-cell foamed metal or a closed-cell foamed metal. Foamed metal components can also present a non-foamed or polymer-coated surface.

Abstract: A wireless-communications-tower component being at least partially formed from a microsphere-filled metal. The microsphere-filled metal has a density of less than 2.7 g/cm3, a thermal conductivity greater than 1 W/m·K, and a coefficient of thermal expansion of less than 30 ?m/m·K. Microspheres suitable for use in such microsphere-filled metal include, for example, glass microspheres, mullite microspheres, alumina microspheres, alumino-silicate microspheres, ceramic microspheres, silica-carbon microspheres, carbon microspheres, and mixtures of two or more thereof.

Abstract: A wireless-communications-tower component being at least partially formed from an aluminum-based material. The aluminum-based material has a density of less than 2.7 g/cm3, a thermal conductivity greater than 1 W/m-K, and a coefficient of thermal expansion of less than 30 ?m/m·K. Such aluminum-based material can be, for example, a foamed aluminum and/or a micro-sphere-filled aluminum.

Abstract: Crosslinkable, semiconductive, peroxide-free thermoplastic compositions having a stable volume resistivity of less than 1000 ohm-cm comprise, based on the weight of the composition: A. 60-90 wt % silane-functionalized polyethylene; B. 0.5-20 wt % organopolysiloxane containing two or more functional end groups; C. 10-20 wt % high conductivity carbon black, e.g., a carbon black having an average particle size of 50 nm or less, a surface area (BET) of 700-1250 m2/g, and an oil absorption (DBP) of 300-500 ml/100 g; and D. 0.05-0.2 wt % crosslinking catalyst.

Abstract: A process for manufacturing a multilayer article, the article comprising two crosslinked semiconductive layers separated by and bonded to an insulation layer, the semiconductive layers formed from a peroxide-crosslinkable olefin elastomer and the insulation layer comprising composition comprising a silane-grafted olefinic elastomer, the process comprises the steps of: (A) injecting the silane-grafted olefinic elastomer between the two crosslinked semiconductive layers so as to have direct contact with each semiconductive layer, and (B) crosslinking the silane-grafted olefinic elastomer in the absence of a peroxide catalyst.

Abstract: Crosslinked, melt-shaped articles are manufactured by a process that does not require the use of post-shaping external heat or moisture, the process comprising the steps of: A. Forming a crosslinkable mixture of a 1. Organopolysiloxane containing one or more functional end groups; and 2. Silane-grafted or silane-copolymerized polyolefin; and B. Melt-shaping and partially crosslinking the mixture; and C. Cooling and continuing crosslinking the melt-shaped article. Crosslinking is promoted by the addition of a catalyst to the mixture before or during melt-shaping or to the melt-shaped article.

Abstract: Nano-composites that comprise a thermoplastic polymer (TPO) and an exfoliated organoclay are prepared by a method comprising contacting under exfoliating conditions at least one molten TPO polymer with at least one organoclay and at least one exfoliating agent of H-TEMPO or an amine precursor to H-TEMPO such that the exfoliating agent exfoliates the organoclay.

Abstract: Crosslinked, melt-shaped articles are manufactured by a process that does not require the use of post-shaping external heat or moisture, the process comprising the steps of: A. Forming a crosslinkable mixture of a 1. Organopolysiloxane containing one or more functional end groups; and 2. Silane-grafted or silane-copolymerized polyolefin; and B. Melt-shaping and partially crosslinking the mixture; and C. Cooling and continuing crosslinking the melt-shaped article. Crosslinking is promoted by the addition of a catalyst to the mixture before or during melt-shaping or to the melt-shaped article.

Abstract: Disclosed is a crosslinkable mixture comprising a polyolefin, an alkoxysilane, an organopolysiloxane, a free radical initiator and a liquid polymer modifier. The organopolysiloxane contains two or more hydroxyl end groups. When the crosslinkable mixture is melt-shaped, a unique crosslinked composition is formed. The liquid polymer modifier improves flexibility of the melt-shaped article without decreasing dielectric strength.

Abstract: A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one liquid epoxy resin; (b) at least one liquid cyclic anhydride hardener; (c) at least one thermally conducting and electrically insulating filler, wherein the filler includes an epoxy-silane treated filler; and (d) at least one cure catalyst with no amine hydrogens; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 120° C.

Abstract: A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one divinylarene dioxide; (b) at least one epoxy resin different from the divinylarene dioxide of component (a); (c) at least one anhydride hardener; (d) at least one filler; and (e) at least one cure catalyst; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 100° C.