Abstract: A method can include attaching an integrated circuit to a printed circuit board in a first solder reflow process at a first reflow temperature. A method can include soldering a heat spreader to the integrated circuit in a second solder reflow process at a second reflow temperature, wherein the second reflow temperature is lower than the first reflow temperature. A method can include attaching a cold plate to the heat spreader such that a thermal interface material is positioned between the heat spreader and the cold plate. Related integrated circuit assemblies are disclosed with thermal interface material, such as solder or a liquid metal, positioned between a heat spreader and an integrated circuit. The thermal interface material has a lower melting temperature than solder on another surface of the integrated circuit.

Abstract: The systems, methods, and devices disclosed herein relate to sandwiched multi-layer structures for cooling electronics. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer, the first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. In some embodiments, at least one layer can use system on wafer packaging.

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

Abstract: A cold plate with an integrated sliding pedestal and a processing system including the same are provided. In one aspect, the processing system includes a printed circuit board (PCB), a first electronic component arranged over the PCB, and a thermal interface material (TIM) arranged over the first electronic component. The system includes at least one sliding pedestal arranged over the TIM. The sliding pedestal is configured to be spaced a variable distance from the PCB. The system also includes a cold plate arranged over the sliding pedestal and configured to provide a coolant to the sliding pedestal and to cool a second electronic component.