Patents by Inventor Mohamed Lebbai Moosa Naina

Mohamed Lebbai Moosa Naina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe for enhanced downbond registration during automatic wire bond process
    Patent number: 6822319
    Abstract: A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line and an array of dots are plated on the die attach pad of the leadframe and around a periphery of the die attach pad. The leadframe is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line and the dots.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: November 23, 2004
    Assignee: QPL Limited
    Inventors: Yung Piu Lau, Mohamed Lebbai Moosa Naina
  • Leadframe for enhanced downbond registration during automatic wire bond process
    Patent number: 6667073
    Abstract: A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line and an array of dots are plated on the die attach pad of the leadframe and around a periphery of the die attach pad. The leadframe is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line and the dots.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: December 23, 2003
    Assignee: Quality Platers Limited
    Inventors: Yung Piu Lau, Mohamed Lebbai Moosa Naina