Patents by Inventor Mohamed Mahmoud Taher EL Gowini

Mohamed Mahmoud Taher EL Gowini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for characterizing adhesive bonding and osseointegration
    Patent number: 9250119
    Abstract: An apparatus and method is provided for characterizing adhesive bonding using an acoustic wave MEMS sensor. The sensor can consist of a silicon substrate, a thin aluminum nitride film on top of the substrate and a thin gold film above the aluminum nitride layer. An adhesive layer is added on top of the sensor and the dispersion property of acoustic waves in the layered configuration can be utilized for bonding integrity characterization. A wave dispersion model is developed to study the effect of changing the interface stiffness on the wave dispersion profile and to investigate the sensitivity of different sensor configurations. The results of the model illustrate that the dispersion profile shifts in the direction of decreasing wave velocity as the interface stiffness decreases.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: February 2, 2016
    Assignees: The Governors of the University of Alberta, Alberta Health Services
    Inventors: Mohamed Mahmoud Taher El Gowini, Walied Ahmed Mohamed Moussa, Edmond Hok Ming Lou
  • APPARATUS AND METHOD FOR CHARACTERIZING ADHESIVE BONDING AND OSSEOINTEGRATION
    Publication number: 20140150558
    Abstract: An apparatus and method is provided for characterizing adhesive bonding using an acoustic wave MEMS sensor. The sensor can consist of a silicon substrate, a thin aluminium nitride film on top of the substrate and a thin gold film above the aluminium nitride layer. An adhesive layer is added on top of the sensor and the dispersion property of acoustic waves in the layered configuration can be utilized for bonding integrity characterization. A wave dispersion model is developed to study the effect of changing the interface stiffness on the wave dispersion profile and to investigate the sensitivity of different sensor configurations. The results of the model illustrate that the dispersion profile shifts in the direction of decreasing wave velocity as the interface stiffness decreases.
    Type: Application
    Filed: May 31, 2013
    Publication date: June 5, 2014
    Inventors: Mohamed Mahmoud Taher EL Gowini, Walied Ahmed Mohamed Moussa, Edmond Hok Ming Lou