Patents by Inventor Mohamed Megahed

Mohamed Megahed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single package wireless communication device
    Publication number: 20070235864
    Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 11, 2007
    Inventor: Mohamed Megahed
  • Leadless chip carrier with embedded inductor
    Patent number: 6710433
    Abstract: One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate signal bond pad and a semiconductor die signal bond pad. In another disclosed embodiment, an inductor is fabricated within the substrate. The inductor comprises via metal segments connecting interconnect metal segments on the top and bottom surfaces of the substrate. The first and second terminals of the inductor are easily accessible through first and second substrate signal bond pads. One embodiment comprises at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and a printed circuit board attached to the bottom surface of the substrate.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: March 23, 2004
    Assignee: Skyworks Solutions, Inc.
    Inventors: Mohamed Megahed, Hassan S. Hashemi
  • Structure and method for fabrication of a leadless chip carrier with embedded antenna
    Patent number: 6582979
    Abstract: A substrate has a top surface for receiving a semiconductor die. An antenna is patterned on the bottom surface of the substrate. The antenna is accessible by coupling it to a via and, through the via, to a substrate signal bond pad and a semiconductor die signal bond pad. In one embodiment, there is at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a substrate bond pad and the printed circuit board. The at least one via also provides an electrical connection between the signal bond pad of the semiconductor die and a land that is electrically connected to the printed circuit board.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: June 24, 2003
    Assignee: Skyworks Solutions, Inc.
    Inventors: Roberto Coccioli, Mohamed Megahed, Hassan S. Hashemi
  • Structure and method for fabrication of a leadless chip carrier with embedded inductor
    Publication number: 20020172025
    Abstract: One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate signal bond pad and a semiconductor die signal bond pad. In another disclosed embodiment, an inductor is fabricated within the substrate. The inductor comprises via metal segments connecting interconnect metal segments on the top and bottom surfaces of the substrate. The first and second terminals of the inductor are easily accessible through first and second substrate signal bond pads. One embodiment comprises at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and a printed circuit board attached to the bottom surface of the substrate.
    Type: Application
    Filed: August 14, 2001
    Publication date: November 21, 2002
    Inventors: Mohamed Megahed, Hassan S. Hashemi
  • Structure and method for fabrication of a leadless chip carrier with embedded antenna
    Publication number: 20020167084
    Abstract: A substrate has a top surface for receiving a semiconductor die. An antenna is patterned on the bottom surface of the substrate. The antenna is accessible by coupling it to a via and, through the via, to a substrate signal bond pad and a semiconductor die signal bond pad. In one embodiment, there is at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a substrate bond pad and the printed circuit board. The at least one via also provides an electrical connection between the signal bond pad of the semiconductor die and a land that is electrically connected to the printed circuit board.
    Type: Application
    Filed: July 26, 2001
    Publication date: November 14, 2002
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Roberto Coccioli, Mohamed Megahed, Hassan S. Hashemi