Abstract: A method for forming an electronic device includes designing a tether having first and second ends; selecting an attachment point on the electronic device; attaching the first end of the tether to the attachment point, the electronic device being encapsulated in a cell; selecting an anchor point; attaching the second end of the tether to the anchor point; determining fracture condition at which the first end of the tether detaches from the attachment point; agitating the cell at the fracture conditions so as to detach the first end of the tether from the attachment point; and separating the electronic device from the cell. Also provided is a method for designing a plurality of electronic devices, wherein each of the electronic devices is encapsulated in a cell of a wafer, die or other holder and wherein the fracture conditions are the same for a group of the electronic devices.

Abstract: A method and apparatus for fabricating one or more electronic devices from wafer, die or other holder including designing a plurality of electronic devices (805), wherein each of the electronic devices is encapsulated in a cell and designing a plurality of tethers (825). Each tether includes a first end and a second end. The method includes selecting an attachment point (835, 860) on each of the plurality of electronic devices, attaching the first end of each of the plurality of tethers to one of the attachment points, selecting a plurality of anchor points (835, 860), attaching the second end of each of the plurality of tethers to one of the anchor points. The method includes determining a fracture condition (835) for each electronic device that breaks the tether at the first end (865). The fracture condition is same for a group of electronic devices in the plurality of electronic devices.