Patents by Inventor Mohammad A. Siddiqui

Mohammad A. Siddiqui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12138140
    Abstract: A wound covering includes a flexible main body, and a sensor element incorporated into the main body. The sensor element includes a mesh formed from a plurality of fibers, and the sensor element is configured to undergo a change in appearance in response to a change in a parameter associated with wound exudate. The wound covering further includes a supply of therapeutic agent configured to diffuse the therapeutic agent from the wound covering into a wound when the wound covering is placed on the wound.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: November 12, 2024
    Assignee: UVIC INDUSTRY PARTNERSHIPS INC
    Inventors: Mohsen Akbari, Bahram Mirani, Aziz Ghahary, Mohammad A. Siddiqui
  • Publication number: 20200188180
    Abstract: A wound covering includes a flexible main body, and a sensor element incorporated into the main body. The sensor element includes a mesh formed from a plurality of fibers, and is configured to undergo a change in appearance in response to a change in a parameter associated with wound exudate. The wound covering further includes a supply of therapeutic agent configured to diffuse therapeutic agent from the wound covering into a wound when the wound covering is placed on a wound.
    Type: Application
    Filed: May 17, 2018
    Publication date: June 18, 2020
    Applicant: UVic Industry Partnerships Inc.
    Inventors: Mohsen Akbari, Bahram Mirani, Aziz Ghahary, Mohammad A. Siddiqui
  • Patent number: 5349237
    Abstract: A plastic-encapsulated integrated circuit includes a package formed of plastic, an integrated circuit embedded in the package, and heat-dissipating means for conducting heat from the integrated circuit, which means include a hermetically sealed container formed of a heat conductive material embedded in the package and extending from the integrated circuit to at least an outer surface of the package, and a volatile fluid disposed in the container. In operation, the volatile fluid absorbs heat from the integrated circuit when it changes from the liquid state to the vapor state, and dissipates heat when it changes from the vapor state to the liquid state.
    Type: Grant
    Filed: March 20, 1992
    Date of Patent: September 20, 1994
    Assignee: VLSI Technology, Inc.
    Inventors: Anthony Sayka, Mohammad A. Siddiqui