Patents by Inventor Mohammad Akhavin

Mohammad Akhavin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6997540
    Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
    Type: Grant
    Filed: October 8, 2003
    Date of Patent: February 14, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Janis Horvath, Brian J. Keefe, Joseph E. Scheffelin, Mohammad Akhavin, David K. McElfresh, Noah Carl Lassar
  • Patent number: 6880246
    Abstract: A method of forming a fluid ejection assembly includes providing a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, extending a support between opposite sides of each of the fluid passages, and mounting a plurality of fluid ejection devices on the substrate, including communicating each of the fluid ejection devices with one of the fluid passages.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: April 19, 2005
    Assignee: Hewlett-Packard Development Company, L.P
    Inventors: Janis Horvath, Mohammad Akhavin, Joseph E. Scheffelin, Brian J. Keefe, David McElfresh, Pere Esterri
  • Publication number: 20040100522
    Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
    Type: Application
    Filed: October 8, 2003
    Publication date: May 27, 2004
    Inventors: Janis Horvath, Brian J. Keefe, Joseph E. Scheffelin, Mohammad Akhavin, David K. McElfresh, Noah Carl Lassar
  • Publication number: 20040087063
    Abstract: Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Inventors: Mohammad Akhavin, Stanley G. Markwell, Janis Horvath, Joseph E. Scheffelin
  • Publication number: 20030231229
    Abstract: A fluid ejection assembly includes a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, with each of the fluid passages having a support extending between opposite sides thereof, and a plurality of fluid ejection devices each mounted on the substrate and communicating with a respective one of the fluid passages.
    Type: Application
    Filed: November 12, 2002
    Publication date: December 18, 2003
    Inventors: Janis Horvath, Mohammad Akhavin, Joseph E. Scheffelin, Brian J. Keefe, David McElfresh, Pere Esterri
  • Patent number: 6520624
    Abstract: A fluid ejection assembly includes a substrate including a plurality of layers and having a plurality of fluid passages extending through the plurality of layers, with each of the fluid passages having a support extending between opposite sides thereof, and a plurality of fluid ejection devices each mounted on the substrate and communicating with a respective one of the fluid passages.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: February 18, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Janis Horvath, Mohammad Akhavin, Joseph E. Scheffelin, Brian J. Keefe, David McElfresh, Pere Esterri
  • Publication number: 20030007034
    Abstract: A fluid ejection assembly includes a substrate and a plurality of fluid ejection devices each mounted on the substrate. The substrate includes a frame formed of a first material and a body formed of a second material such that the body substantially surrounds the frame and forms a first side and a second side of the substrate with each of the fluid ejection devices being mounted on the first side of the substrate.
    Type: Application
    Filed: August 28, 2002
    Publication date: January 9, 2003
    Inventors: Janis Horvath, Brian J. Keefe, Joseph E. Scheffelin, Mohammad Akhavin, David K. McElfresh, Noah Carl Lassar