Patents by Inventor Mohammad Ayyash

Mohammad Ayyash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11229219
    Abstract: The camel-milk products with plant-based protein additives include camel milk in the form of plant-based milk, plant-based milk powder and/or derivatives thereof and have enhanced gel strength. The plant-based protein additives may be derived from soybeans; oats; almonds; lupin chickpeas or navy beans. The camel-milk products include fermented and non-fermented camel-milk products, such as: set and stir yogurt; all cheese varieties; cultured camel milks; and custard-based products. The camel-milk products are prepared by mixing camel milk with plant-based protein additives to form a mixture and coagulating the mixture by acid or enzyme treatment.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: January 25, 2022
    Assignee: UNITED ARAB EMIRATES UNIVERSITY
    Inventor: Mutamed Mohammad Ayyash
  • Patent number: 9355968
    Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: May 31, 2016
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Ming Cheng, Ken Wang, Tian Tian, Mohammad Ayyash, Tuyen Pham, Brian Rush
  • Publication number: 20150364431
    Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.
    Type: Application
    Filed: September 26, 2014
    Publication date: December 17, 2015
    Inventors: Ming Cheng, Ken Wang, Tian Tian, Mohammad Ayyash, Tuyen Pham, Brian Rush