Patents by Inventor Mohammad Ayyash

Mohammad Ayyash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon shield for package stress sensitive devices
    Patent number: 9355968
    Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: May 31, 2016
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Ming Cheng, Ken Wang, Tian Tian, Mohammad Ayyash, Tuyen Pham, Brian Rush
  • SILICON SHIELD FOR PACKAGE STRESS SENSITIVE DEVICES
    Publication number: 20150364431
    Abstract: A surface mount semiconductor package, semiconductor device, and method for fabrication of the surface mount semiconductor package and electrical device are described that include a leadframe assembly, an integrated circuit device disposed on the leadframe assembly, a silicon shield disposed on the integrated circuit device, where the silicon shield is configured to mitigate packaging stress to the integrated circuit device, and a molding layer that encapsulates the integrated circuit device, the silicon shield, and at least a portion of the leadframe assembly.
    Type: Application
    Filed: September 26, 2014
    Publication date: December 17, 2015
    Inventors: Ming Cheng, Ken Wang, Tian Tian, Mohammad Ayyash, Tuyen Pham, Brian Rush