Patents by Inventor Mohammad Eslamy
Mohammad Eslamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8120154Abstract: Embodiments in accordance with the present invention relate to techniques which avoid the problems of deformation in the shape of a solder connection in a flip chip package, resulting from solder reflow. In one embodiment, a solder-repellent surface is created adjacent to the solder to constrain the reflow and thereby maintain the vertical profile of the solder. Examples of such a solder-repellent surface include an oxide (such as Brown Oxide) of the lead frame, or a tape (such as Kapton) which is used as a dam bar to control/constrain the solder flow on the leads prior to the encapsulation step. In another embodiment, the solder connection may be formed from at least two components. The first component may reflow at high temperatures to provide the necessary adhesion between solder ball and the die, with the second component reflowing at a lower temperature to provide the necessary adhesion between the solder ball and the leads.Type: GrantFiled: February 19, 2010Date of Patent: February 21, 2012Assignee: GEM Services, Inc.Inventors: Mohammad Eslamy, Anthony C. Tsui
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Patent number: 8106493Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.Type: GrantFiled: October 13, 2010Date of Patent: January 31, 2012Assignee: GEM Services, Inc.Inventors: Anthony C. Tsui, Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu
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Patent number: 8011089Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: GrantFiled: August 25, 2009Date of Patent: September 6, 2011Assignee: FormFactor, Inc.Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
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Publication number: 20110171838Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: ApplicationFiled: March 28, 2011Publication date: July 14, 2011Applicant: FORMFACTOR, INC.Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
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Publication number: 20110024886Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.Type: ApplicationFiled: October 13, 2010Publication date: February 3, 2011Applicant: GEM Services, Inc.Inventors: Anthony C. Tsui, Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu
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Patent number: 7838339Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.Type: GrantFiled: August 14, 2008Date of Patent: November 23, 2010Assignee: GEM Services, Inc.Inventors: Anthony C. Tsui, Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu
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Publication number: 20100140762Abstract: Embodiments in accordance with the present invention relate to techniques which avoid the problems of deformation in the shape of a solder connection in a flip chip package, resulting from solder reflow. In one embodiment, a solder-repellent surface is created adjacent to the solder to constrain the reflow and thereby maintain the vertical profile of the solder. Examples of such a solder-repellent surface include an oxide (such as Brown Oxide) of the lead frame, or a tape (such as Kapton) which is used as a dam bar to control/constrain the solder flow on the leads prior to the encapsulation step. In another embodiment, the solder connection may be formed from at least two components. The first component may reflow at high temperatures to provide the necessary adhesion between solder ball and the die, with the second component reflowing at a lower temperature to provide the necessary adhesion between the solder ball and the leads.Type: ApplicationFiled: February 19, 2010Publication date: June 10, 2010Applicant: GEM Services, Inc.Inventors: Mohammad Eslamy, Anthony C. Tsui
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Patent number: 7691670Abstract: Embodiments in accordance with the present invention relate to techniques which avoid the problems of deformation in the shape of a solder connection in a flip chip package, resulting from solder reflow. In one embodiment, a solder-repellent surface is created adjacent to the solder to constrain the reflow and thereby maintain the vertical profile of the solder. Examples of such a solder-repellent surface include an oxide (such as Brown Oxide) of the lead frame, or a tape (such as Kapton) which is used as a dam bar to control/constrain the solder flow on the leads prior to the encapsulation step. In another embodiment, the solder connection may be formed from at least two components. The first component may reflow at high temperatures to provide the necessary adhesion between solder ball and the die, with the second component reflowing at a lower temperature to provide the necessary adhesion between the solder ball and the leads.Type: GrantFiled: July 11, 2008Date of Patent: April 6, 2010Assignee: GEM Services, Inc.Inventors: Mohammad Eslamy, Anthony C. Tsui
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Publication number: 20100043226Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: ApplicationFiled: August 25, 2009Publication date: February 25, 2010Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
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Publication number: 20090283919Abstract: Embodiments in accordance with the present invention relate to flip-chip packages for semiconductor devices, which feature a die sandwiched between metal layers. One metal layer comprises portions of the lead frame configured to be in electrical and thermal communication with various pads on a first surface of the die (e.g. IC pads or MOSFET gate or source pads) through a solder ball contact. The other metal layer is configured to be in at least thermal communication with the opposite side of the die. Embodiments of packages in accordance with the present invention exhibit superior heat dissipation qualities, while avoiding the expense of wire bonding. Embodiments of the present invention are particularly suited for packaging of power devices.Type: ApplicationFiled: August 5, 2008Publication date: November 19, 2009Applicant: GEM Services, Inc.Inventors: Anthony C. Tsui, Mohammad Eslamy
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Publication number: 20090273065Abstract: Embodiments in accordance with the present invention relate to techniques which avoid the problems of deformation in the shape of a solder connection in a flip chip package, resulting from solder reflow. In one embodiment, a solder-repellent surface is created adjacent to the solder to constrain the reflow and thereby maintain the vertical profile of the solder. Examples of such a solder-repellent surface include an oxide (such as Brown Oxide) of the lead frame, or a tape (such as Kapton) which is used as a dam bar to control/constrain the solder flow on the leads prior to the encapsulation step. In another embodiment, the solder connection may be formed from at least two components. The first component may reflow at high temperatures to provide the necessary adhesion between solder ball and the die, with the second component reflowing at a lower temperature to provide the necessary adhesion between the solder ball and the leads.Type: ApplicationFiled: July 11, 2008Publication date: November 5, 2009Applicant: GEM Services, Inc.Inventors: Mohammad Eslamy, Anthony C. Tsui
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Publication number: 20090250796Abstract: Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.Type: ApplicationFiled: August 14, 2008Publication date: October 8, 2009Applicant: GEM Services, Inc.Inventors: Anthony C. Tsui, Mohammad Eslamy, Anthony Chia, Hongbo Yang, Ming Zhou, Jian Xu
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Patent number: 7578057Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: GrantFiled: June 27, 2006Date of Patent: August 25, 2009Assignee: FormFactor, Inc.Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
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Patent number: 7215131Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: GrantFiled: June 7, 1999Date of Patent: May 8, 2007Assignee: Formfactor, Inc.Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
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Publication number: 20060244469Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: ApplicationFiled: June 27, 2006Publication date: November 2, 2006Inventors: Mohammad Eslamy, David Pedersen, Harry Cobb
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Publication number: 20060163462Abstract: A photodetector for power monitoring purposes may be positioned directly on a planar light circuit. The photodetector may be protected by hermetically sealing a localized region over the planar light circuit corresponding to the position of the photodetector. The remainder of the planar light circuit may remain unsealed.Type: ApplicationFiled: March 29, 2006Publication date: July 27, 2006Inventor: Mohammad Eslamy
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Patent number: 7065870Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: GrantFiled: September 22, 2003Date of Patent: June 27, 2006Assignee: FormFactor, Inc.Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb
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Publication number: 20040183003Abstract: A photodetector for power monitoring purposes may be positioned directly on a planar light circuit. The photodetector may be protected by hermetically sealing a localized region over the planar light circuit corresponding to the position of the photodetector. The remainder of the planar light circuit may remain unsealed.Type: ApplicationFiled: March 21, 2003Publication date: September 23, 2004Inventor: Mohammad Eslamy
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Patent number: 6784536Abstract: An improved structure for an organic ball-grid array chip carrier having an organic substrate attached to a metal heat sink plate to prevent the chip carrier from warping. A supplemental organic substrate is attached to the metal heat sink plate on the side opposite from the functional organic substrate to provide symmetry to the bending forces resulting from the mismatch in coefficients of thermal expansion between the organic substrate and the metal heat sink plate.Type: GrantFiled: August 23, 2001Date of Patent: August 31, 2004Assignee: Altera CorporationInventor: Mohammad Eslamy
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Publication number: 20040058487Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.Type: ApplicationFiled: September 22, 2003Publication date: March 25, 2004Applicant: FormFactor, Inc.Inventors: Mohammad Eslamy, David V. Pedersen, Harry D. Cobb