Patents by Inventor Mohammad Farahani

Mohammad Farahani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Offset solder bump method and apparatus
    Publication number: 20060264021
    Abstract: An apparatus, method, and system for integrated circuit packaging having an offset solder bump are disclosed herein. A semiconductor substrate has a bond pad and a passivation layer located on an active surface thereof. A solder terminal contacts both the bond pad and passivation layer. A solder bump contacts the solder terminal and is positioned laterally offset from the bond pad.
    Type: Application
    Filed: May 17, 2005
    Publication date: November 23, 2006
    Inventors: Mohammad Farahani, Priyavadan Patel, Sriram Muthukumar
  • Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same
    Publication number: 20060137732
    Abstract: A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.
    Type: Application
    Filed: December 27, 2004
    Publication date: June 29, 2006
    Inventors: Mohammad Farahani, Gregory Chrysler, Kris Frutschy