Patents by Inventor Mohammad Hossain Biglari

Mohammad Hossain Biglari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9943930
    Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: April 17, 2018
    Assignees: Koninklijke Philips N.V., Mat-Tech B.V.
    Inventors: Nicolaas Johannes Antonius Van Veen, Mohammad Hossain Biglari
  • Patent number: 8298680
    Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: October 30, 2012
    Assignees: Koninklijke Philips Electronics N.V., Mat-Tech B.V.
    Inventors: Nicolaas Johannes Anthonius Van Veen, Mohammad Hossain Biglari
  • Publication number: 20090162622
    Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
    Type: Application
    Filed: May 11, 2005
    Publication date: June 25, 2009
    Applicants: DUTCH POLYMER INSTITUTE, MAT-TECH B.V.
    Inventors: Nicolaas Johannes Anthonius Van Veen, Mohammad Hossain Biglari