Patents by Inventor Mohammad Kabir

Mohammad Kabir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240255597
    Abstract: In one aspect, the disclosure relates to hyperpolarized target molecules and contrast agents comprising the same, methods of making the same, and methods of imaging using same. In a further aspect, imaging performed using the hyperpolarized target molecules and contrast agent can enable real time monitoring and diagnosis of diseases including various cancers and metabolic disorders. The methods are cryogen-free and inexpensive and can be performed in a short time. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.
    Type: Application
    Filed: July 26, 2022
    Publication date: August 1, 2024
    Inventors: Thomas Theis, Mustapha Abdulmojeed, Sören Lehmkuhl, Patrick TomHon, Iuliia Mandzhieva, Eduard Y. Chekmenev, Isaiah Adelabu, Mohammad Kabir, Shiraz Nantogma, Jessica Ettedgui, Rolf Eric Swenson, Boyd Goodson
  • Patent number: 12014996
    Abstract: Moisture hermetic guard ring structures for semiconductor devices, related systems, and methods of fabrication are disclosed. Such devices systems, and methods include a guard ring structure laterally surrounding semiconductor devices of a device layer and metal interconnects of an interconnect layer, the guard ring structure extending through the interconnect layer, the device layer, and a bonding layer adjacent one of the interconnect layer or the device layer the bonding layer, and contacting a support substrate coupled to the bonding layer. Such devices systems, and methods may further include via structures having the same material system as the guard ring structure and also extending through the interconnect, the device, and bonding layers and contacting a support substrate.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: June 18, 2024
    Assignee: Intel Corporation
    Inventors: Mohammad Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki, Hannes Greve, Avyaya Jayanthinarasimham, Mukund Bapna, Doug B. Ingerly
  • Publication number: 20240145410
    Abstract: Moisture hermetic guard ring structures for semiconductor devices, related systems, and methods of fabrication are disclosed. Such devices systems, and methods include a guard ring structure laterally surrounding semiconductor devices of a device layer and metal interconnects of an interconnect layer, the guard ring structure extending through the interconnect layer, the device layer, and a bonding layer adjacent one of the interconnect layer or the device layer the bonding layer, and contacting a support substrate coupled to the bonding layer. Such devices systems, and methods may further include via structures having the same material system as the guard ring structure and also extending through the interconnect, the device, and bonding layers and contacting a support substrate.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Mohammad Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki, Hannes Greve, Avyaya Jayanthinarasimham, Mukund Bapna, Doug B. Ingerly
  • Publication number: 20210407932
    Abstract: Moisture hermetic guard ring structures for semiconductor devices, related systems, and methods of fabrication are disclosed. Such devices systems, and methods include a guard ring structure laterally surrounding semiconductor devices of a device layer and metal interconnects of an interconnect layer, the guard ring structure extending through the interconnect layer, the device layer, and a bonding layer adjacent one of the interconnect layer or the device layer the bonding layer, and contacting a support substrate coupled to the bonding layer. Such devices systems, and methods may further include via structures having the same material system as the guard ring structure and also extending through the interconnect, the device, and bonding layers and contacting a support substrate.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 30, 2021
    Applicant: Intel Corporation
    Inventors: Mohammad Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki, Hannes Greve, Avyaya Jayanthinarasimham, Mukund Bapna, Doug B. Ingerly
  • Publication number: 20070223633
    Abstract: A multi-stage non-overlapping clock signal generator as described herein is suitable for use with a pipelined analog-to-digital converter architecture. The clock signal generator generally includes a back end clock generator, a second stage clock generator, and a first stage clock generator coupled in series. The clock signal generator may also include any number of intermediate stage clock generators coupled in series between the back end clock generator and the second stage clock generator. Example implementations of the various clock generator stages are also described herein.
    Type: Application
    Filed: March 22, 2006
    Publication date: September 27, 2007
    Inventors: Douglas Garrity, Mohammad Kabir
  • Publication number: 20070096304
    Abstract: The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.
    Type: Application
    Filed: August 28, 2006
    Publication date: May 3, 2007
    Inventor: Mohammad Kabir