Patents by Inventor Mohammad Matiar Rahman Howlader

Mohammad Matiar Rahman Howlader has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding substrates and device for bonding substrates
    Patent number: 7550366
    Abstract: A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: June 23, 2009
    Assignee: Ayumi Industry
    Inventors: Tadatomo Suga, Mohammad Matiar Rahman Howlader, Tomoyuki Abe