Abstract: A computer-implemented fraud detection method and system for periodically identifying network associations in a consumer population at a national credit reporting agency and computing associated network level variables related to credit use and potential first party fraud for the consumer population. In response to receiving a request for a target account from among the consumer population the computer-implemented system retrieves credit report for the target account and computes tradeline or account level variables related to credit use and potential fraudulent behavior. A fraud score is calculated based on a combined evaluation of the network level variables and the tradeline or account level variables.

Abstract: The invention provides a method for manufacturing an integrated circuit. The method, in one embodiment, includes inspecting a semiconductor wafer including a plurality of die for a defect, the inspecting providing an image of the semiconductor wafer including the defect. The method further includes identifying an area of the semiconductor wafer from the image, wherein the identified area encompasses at least those die including any portion of the defect, and dicing the semiconductor wafer into individual die. The die defined by the identified area, in this embodiment, are then discarded.

Abstract: The invention provides a method for manufacturing an integrated circuit. The method, in one embodiment, includes inspecting a semiconductor wafer including a plurality of die for a defect, the inspecting providing an image of the semiconductor wafer including the defect. The method further includes identifying an area of the semiconductor wafer from the image, wherein the identified area encompasses at least those die including any portion of the defect, and dicing the semiconductor wafer into individual die. The die defined by the identified area, in this embodiment, are then discarded.