Patents by Inventor Mohammad R. Mirbedini

Mohammad R. Mirbedini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of trenches with multiple depths on the same substrate
    Patent number: 7189628
    Abstract: Dual trench depths are achieved on the same wafer by forming an initial trench having a depth corresponding to the difference in final depths of the shallow and deep trenches. A second mask is used to open areas for the deep trenches over the preliminary trenches and for the shallow trenches at additional locations. Etching of the shallow and deep trenches then proceeds simultaneously.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: March 13, 2007
    Assignee: LSI Logic Corporation
    Inventors: Mohammad R. Mirbedini, Venkatesh P. Gopinath, Hong Lin, Verne Hornback, Dodd Defibaugh, Ynhi Le
  • Fabrication of trenches with multiple depths on the same substrate
    Patent number: 6864152
    Abstract: Dual trench depths are achieved on the same wafer by forming an initial trench having a depth corresponding to the difference in final depths of the shallow and deep trenches. A second mask is used to open areas for the deep trenches over the preliminary trenches and for the shallow trenches at additional locations. Etching of the shallow and deep trenches then proceeds simultaneously.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: March 8, 2005
    Assignee: LSI Logic Corporation
    Inventors: Mohammad R. Mirbedini, Venkatesh P. Gopinath, Hong Lin, Verne Hornback, Dodd Defibaugh, Ynhi Le