Patents by Inventor Mohammad Rizwanullah

Mohammad Rizwanullah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-current flexible conductive circuits with connectors
    Patent number: 12646636
    Abstract: A flexible conductive assembly includes a flexible shielded high-current circuit having first and second circuit portions, each with conductive layers and an electromagnetic shield. Contacts are mechanically and electrically coupled to the conductive layers and extend into a connector housing. The housing incorporates electromagnetic shield portions electrically joined to the circuit shields, and a wire seal that protects against environmental ingress while maintaining electrical isolation. By combining flat conductor layers, integrated shielding, and sealed connector structures, the assembly provides a compact, lightweight, and reliable flexible shielded circuit for transmitting high currents with reduced electromagnetic emissions.
    Type: Grant
    Filed: October 13, 2025
    Date of Patent: June 2, 2026
    Assignee: CelLink Corporation
    Inventors: Lewis Richard Galligan, Andrew Fisher, Kevin Coakley, Muthu Sebastian, Jean-Paul Ortiz, Arturo Cantu-Chavez, Mark Terlaak, Will Findlay, Gary Cook, James Jeon, Mohammad Rizwanullah
  • High-Current Flexible Conductive Circuits with Connectors
    Publication number: 20260106053
    Abstract: A flexible conductive assembly includes a flexible shielded high-current circuit having first and second circuit portions, each with conductive layers and an electromagnetic shield. Contacts are mechanically and electrically coupled to the conductive layers and extend into a connector housing. The housing incorporates electromagnetic shield portions electrically joined to the circuit shields, and a wire seal that protects against environmental ingress while maintaining electrical isolation. By combining flat conductor layers, integrated shielding, and sealed connector structures, the assembly provides a compact, lightweight, and reliable flexible shielded circuit for transmitting high currents with reduced electromagnetic emissions.
    Type: Application
    Filed: October 13, 2025
    Publication date: April 16, 2026
    Inventors: Lewis Richard Galligan, Andrew Fisher, Kevin Coakley, Muthu Sebastian, Jean-Paul Ortiz, Arturo Cantu-Chavez, Mark Terlaak, Will Findlay, Gary Cook, James Jeon, Mohammad Rizwanullah