Abstract: The power sensing device includes a power input interface in electrical communication with a current sensing circuit and a voltage sensing circuit. The current sensing circuit is connected to a load. The voltage sensing circuit is connected in parallel with the load. A metering integrated circuit and a micro-controller unit (MCU) are included. The metering integrated circuit receives a first analog signal indicating a load current value from the current sensing circuit, and a second analog signal indicating a load voltage value from the voltage sensing circuit. The metering integrated circuit converts first and second analog input signals to first and second digital signals, respectively, and generates the first and second digital signals as digital communication pulses to the MCU. A decoder circuit includes a communications port to send and receive data associated with a sensed current parameter and a sensed voltage parameter.

Abstract: An electrical circuit for protection of a solid-state relay includes a switch element connected between an input signal source and an input terminal of the solid-state relay. The solid-state relay includes an output terminal for connection to a load. A sensing element is associated with the solid-state relay to sense an operating parameter associated with the solid-state relay. A feedback element controls the switch element to switch an operating state in response to the operating parameter exceeding a reference parameter. The solid-state relay changes state in response to the switch element to control an output current of the solid-state relay between an energized or de-energized state.

Abstract: An electrical circuit for protection of a solid-state relay includes a switch element connected between an input signal source and an input terminal of the solid-state relay. The solid-state relay includes an output terminal for connection to a load. A sensing element is associated with the solid-state relay to sense an operating parameter associated with the solid-state relay. A feedback element controls the switch element to switch an operating state in response to the operating parameter exceeding a reference parameter. The solid-state relay changes state in response to the switch element to control an output current of the solid-state relay between an energized or de-energized state.

Abstract: A light emitting diode (LED) assembly is provided having a LED and a temperature sensor for monitoring a temperature of the LED. An active cooling circuit receives temperature input from the temperature sensor. The temperature input is indicative of the temperature of the LED. An active cooling system cools the LED. The active cooling system being controlled by the active cooling circuit to control a temperature of the LED.

Abstract: The power sensing device includes a power input interface in electrical communication with a current sensing circuit and a voltage sensing circuit. The current sensing circuit is connected to a load. The voltage sensing circuit is connected in parallel with the load. A metering integrated circuit and a micro-controller unit (MCU) are included. The metering integrated circuit receives a first analog signal indicating a load current value from the current sensing circuit, and a second analog signal indicating a load voltage value from the voltage sensing circuit. The metering integrated circuit converts first and second analog input signals to first and second digital signals, respectively, and generates the first and second digital signals as digital communication pulses to the MCU. A decoder circuit includes a communications port to send and receive data associated with a sensed current parameter and a sensed voltage parameter.

Abstract: An electrical connector is provided for connecting a light emitting diode (LED) to a driver. The electrical connector includes a housing, a driver input contact held by the housing and configured to be electrically connected to a power output of the driver, and an LED output contact held by the housing and configured to be electrically connected to a power input of the LED. An electrical path is defined between the driver input contact and the LED output contact for supplying electrical power from the driver to the power input of the LED. The electrical connector includes a temperature monitor and control (TMC) module operatively connected to a temperature sensor for receiving a temperature associated with the LED. The TMC module is configured to control the flow of electrical power from the driver input contact to the LED output contact based on the temperature received from the temperature sensor.

Abstract: A light emitting diode (LED) verification system is provided having a mounting module for securing an LED board for testing. The mounting module includes a thermal management system for controlling the temperature of the LED board. A mounting plate is provided for centering the LED board. A clamp is provided for securing the LED board. A hood is positioned over the mounting module. The hood has a top and a base. The mounting module is positioned at the base of the hood. The mounting plate centers the LED board with respect to a centerline of the hood. A light meter is positioned at the top of the hood and centered with respect to the centerline of the hood. The light meter measures light emitted from the LED board.

Abstract: A modular system and method for providing power for LED lighting systems. The power source unit comprises (1) a power supply that converts A/C voltage to regulated D/C voltage, (2) a configurable intelligent gateway module that receives the regulated D/C voltage and places it on a power bus to which one or more power node modules and any accessories in need of power, such as motion detectors or cooling units, are coupled, and (3) an intelligent power node module that converts the regulated D/C voltage to a regulated D/C current and provides it to the particular LED Light Module (LLM), and which also receives data from the LLM, such as temperature data, and adjusts the regulated current accordingly. The gateway module also may receive control data from control devices, such as dimmers or wireless controllers, and instruct the power node module to regulate its output current accordingly.

Abstract: A light emitting diode (LED) verification system is provided having a mounting module for securing an LED board for testing. The mounting module includes a thermal management system for controlling the temperature of the LED board. A mounting plate is provided for centering the LED board. A clamp is provided for securing the LED board. A hood is positioned over the mounting module. The hood has a top and a base. The mounting module is positioned at the base of the hood. The mounting plate centers the LED board with respect to a centerline of the hood. A light meter is positioned at the top of the hood and centered with respect to the centerline of the hood. The light meter measures light emitted from the LED board.

Abstract: A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a temperature sensor operatively connected to the LED assembly at a remote location that is remote from the LED junction. The temperature sensor is configured to measure a temperature of the LED assembly at the remote location. A temperature calculation module is operatively connected to the temperature sensor for receiving the measured temperature at the remote location from the temperature sensor. The temperature calculation module is configured to determine a junction temperature at the LED junction based on the measured temperature a the remote location.

Abstract: A light emitting diode (LED) assembly is provided having a LED and a temperature sensor for monitoring a temperature of the LED. An active cooling circuit receives temperature input from the temperature sensor. The temperature input is indicative of the temperature of the LED. An active cooling system cools the LED. The active cooling system being controlled by the active cooling circuit to control a temperature of the LED.

Abstract: An electrical connector is provided for connecting a light emitting diode (LED) to a driver. The electrical connector includes a housing, a driver input contact held by the housing and configured to be electrically connected to a power output of the driver, and an LED output contact held by the housing and configured to be electrically connected to a power input of the LED. An electrical path is defined between the driver input contact and the LED output contact for supplying electrical power from the driver to the power input of the LED. The electrical connector includes a temperature monitor and control (TMC) module operatively connected to a temperature sensor for receiving a temperature associated with the LED. The TMC module is configured to control the flow of electrical power from the driver input contact to the LED output contact based on the temperature received from the temperature sensor.

Abstract: A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a temperature sensor operatively connected to the LED assembly at a remote location that is remote from the LED junction. The temperature sensor is configured to measure a temperature of the LED assembly at the remote location. A temperature calculation module is operatively connected to the temperature sensor for receiving the measured temperature at the remote location from the temperature sensor. The temperature calculation module is configured to determine a junction temperature at the LED junction based on the measured temperature a the remote location.