Abstract: In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.

Abstract: In a heat spreading module for a portable electronic device configured such that a heat pipe is attached along a metal plate with which a heating element is brought into close contact, and heat of a heated region of the metal plate with which the heating element is brought into close contact is transferred to a place on the metal plate apart from the heated region by the heat pipe, the heat pipe is configured such that a container is formed of a pipe, a portion of the container arranged on the heated region is a heated portion, and a portion of the container apart from the heated region is a heat dissipation portion that dissipates heat to the metal plate, and the heated portion is formed in a flat shape, and the heat dissipation portion is formed to be thicker than the heated portion having the flat shape.

Abstract: A heat spreading module for a portable electronic device includes a metal plate to which a heat generation body contacts, a first heat pipe that is attached along the metal plate, transfers heat of a heating region of the metal plate, to which the heat generation body contacts, to a region that is away from the heating region of the metal plate, comprises a first end portion and a second end portion, has a predetermined length, and a portion of the first end portion is arranged in the heating region, and a second heat pipe that is arranged away from the heating region and is longer in length than the first heat pipe.

Abstract: A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.

Abstract: A heat pipe for improving heat transport performance by reducing heat resistance in an evaporating section is provided. The heat pipe comprises a groove wick extending in the longitudinal direction from the evaporating section to the condensing section through the insulated section in the container. A metal powder layer formed of metal powder adhering to the inner wall of the groove wick is arranged in the evaporating section. The metal powder layer is formed into the groove wick having a predetermined thickness.

Abstract: A heat pipe a flat heat pipe having enhanced heat transport capacity is provided. The flat heat pipe 1 comprises a working fluid encapsulated in a container 2, a first wick 11 that returns the working fluid from a condensing portion 4 to an evaporating portion 3 by a capillary pumping, and a second wick 12 that spreads the working fluid returned thereto over an inner face of the container by a capillary pumping. The second wick is formed only in the evaporating portion 3 to extend in a circumferential direction on the inner face of the container 2.

Abstract: A heat pipe having enhanced heat transport capacity that can be manufactured easily is provided. The heat pipe 1 comprises a sealed container 2 and a wick structure 10. The wick structure includes a first wick 11 formed of copper fibers 11a, and a second wick formed of carbon fibers 12a. The first wick 11 is sintered to be fixed to an inner face 21a of a flat wall 21 while holding the second wick 12 therein.

Abstract: A heat transport device having enhanced heat transport capacity is provided. The heat transport device comprises an evacuated and sealed container 2, and phase changeable working fluid encapsulated in the container to transport heat a fiber wick 3 is laid on an inner face of the container 2 in a longitudinal direction, and a powder wick is formed on a surface of the fiber wick 3. A thickness of the powder wick is five to ten times smaller than a diameter of the fiber.

Abstract: A thin flat heat pipe capable of transporting heat even if it is bent is provided. The flat heat pipe comprises: a working fluid to be evaporated when heated and to be condensed when the heat dissipates; and a wick, which is formed by bundling a plurality of thin wires while twisting along a center axis thereof, and which is adapted to create a capillary pressure for returning the liquid phase working fluid to a portion where evaporation takes place. The wick is arranged over the entire length of the flat container while being in contact with both upper and lower inner faces of the container or with an inner side face of the container in a manner such that an inner space of the container for letting through an evaporated working fluid is not closed, and a contact portion between the wick and the container is fixed by sintering over the entire length of the wick.