Abstract: A circuit for power on data line (PoDL) injection includes a power source, a first and a second coupling component, and an interface. The power source provides one or more DC voltage levels. The first coupling component couples the power source to an interface for coupling to a transmission medium. An Ethernet device is coupled through the second coupling component to the interface. The first coupling component is a balanced component, and the Ethernet device is isolated from the power source via a pair of DC blocking capacitors connected between the first coupling component and the second coupling component.

Abstract: A speaker system includes a speaker and control circuitry, wherein the control circuitry includes an Ethernet port, and wherein power to the control circuitry is supplied by an Ethernet connection to the Ethernet port. In some embodiments, digital audio data is also supplied by the Ethernet connection, and in other embodiments digital audio data is wirelessly supplied. In some embodiments, the control circuitry is mounted on a printed circuit board (PCB) and includes a digital to analog converter and an amplifier. In some embodiments the printed circuit board has a semi-annular shape and is mounted to the speaker around a transducer of the speaker. The speaker includes an electromagnetic shield surrounding portions of the transducer proximate to the printed circuit board.

Abstract: A system for playing audio recordings includes a transmitter configured to separately encode and transmit each of a plurality of components of an audio recording to a plurality of receivers each configured to receive and decode one of the encoded components of the audio recording. In another embodiment, a method for playing audio recordings includes encoding each of a plurality of components of an audio recording, assigning each of the plurality of components to a specific receiver, transmitting each of the encoded components to the assigned receiver, decoding each of the encoded components and outputting each of the decoded components.

Abstract: A protective case for a mobile device includes at least one speaker and first and second wireless communication modules for first and second wireless communication protocols. In some embodiments the case includes a battery. In some embodiments the case in the case includes a sliding interface for connecting the case and mobile device. In some embodiments the case includes at least one ambient light device. The wireless interfaces of the case allow connection between multiple cases such the one case can broadcast a signal to multiple cases.

Abstract: A circuit for power on data line (PoDL) injection includes a power source, a first and a second coupling component, and an interface. The power source provides one or more DC voltage levels. The first coupling component couples the power source to an interface for coupling to a transmission medium. An Ethernet device is coupled through the second coupling component to the interface. The first coupling component is a balanced component, and the Ethernet device is isolated from the power source via a pair of DC blocking capacitors connected between the first coupling component and the second coupling component.

Abstract: A system and method for switching in an energy efficient network. Rapid switching between multiple operating modes can generate a voltage spike or voltage lag on an on-board inductor. Suppression of the voltage spike or voltage lag can be enabled through the activation of by a physical layer device of an inductor bypass path at a time proximate to the switching between multiple operating modes.

Abstract: Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Abstract: A system and method for switching in an energy efficient network. Rapid switching between multiple operating modes can generate a voltage spike or voltage lag on an on-board inductor. Suppression of the voltage spike or voltage lag can be enabled through the activation of by a physical layer device of an inductor bypass path at a time proximate to the switching between multiple operating modes.

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract: Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract: According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.

Abstract: A printed circuit board includes two differential signal traces, a layer of core material, a layer of filler material, and a ground plane. The filler material is replaced by an air core under the differential signal traces.