Patents by Inventor Mohammad Waseem Hussain
Mohammad Waseem Hussain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11855001Abstract: A semiconductor device package includes a leadless leadframe, and a plurality of terminal pads extending to a periphery of the leadframe. At least two of the plurality of terminal pads are interior extending terminal pads that include an interior portion having a shape including at least one curved portion and an exterior portion that extends to the periphery of the leadframe. An integrated circuit (IC) die having at least a semiconductor surface includes circuitry configured for at least one function having nodes connected to bond pads on the leadframe. There is a bonding arrangement between the plurality of terminal pads and the bond pads. A mold compound is for encapsulation of the semiconductor device package.Type: GrantFiled: November 4, 2020Date of Patent: December 26, 2023Assignee: Texas Instruments IncorporatedInventors: Mohammad Waseem Hussain, David Taiwai Chin, Dorothy Lyou Mantle
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Publication number: 20230129232Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.Type: ApplicationFiled: December 22, 2022Publication date: April 27, 2023Inventors: Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro
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Patent number: 11569154Abstract: An electronic device includes a package structure, a first lead and a second lead. The first lead has a first portion extending outward from a side of the package structure and downward, and a second portion extending outward from the first portion away from the package side. The second lead has a first portion extending outward from the package side and downward, and a second portion extending inward from the first portion toward the package side, and a distal end of the second lead is spaced from the package side.Type: GrantFiled: May 27, 2021Date of Patent: January 31, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Mohammad Waseem Hussain, Anis Fauzi Bin Abdul Aziz
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Patent number: 11538741Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.Type: GrantFiled: February 17, 2021Date of Patent: December 27, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro
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Publication number: 20220384317Abstract: An electronic device includes a package structure, a first lead and a second lead. The first lead has a first portion extending outward from a side of the package structure and downward, and a second portion extending outward from the first portion away from the package side. The second lead has a first portion extending outward from the package side and downward, and a second portion extending inward from the first portion toward the package side, and a distal end of the second lead is spaced from the package side.Type: ApplicationFiled: May 27, 2021Publication date: December 1, 2022Applicant: Texas Instruments IncorporatedInventors: Mohammad Waseem Hussain, Anis Fauzi Bin Abdul Aziz
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Patent number: 11410913Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.Type: GrantFiled: March 18, 2020Date of Patent: August 9, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Mohammad Waseem Hussain, Steven Murphy, Leslie E. Stark
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Publication number: 20220139847Abstract: A semiconductor device package includes a leadless leadframe, and a plurality of terminal pads extending to a periphery of the leadframe. At least two of the plurality of terminal pads are interior extending terminal pads that include an interior portion having a shape including at least one curved portion and an exterior portion that extends to the periphery of the leadframe. An integrated circuit (IC) die having at least a semiconductor surface includes circuitry configured for at least one function having nodes connected to bond pads on the leadframe. There is a bonding arrangement between the plurality of terminal pads and the bond pads. A mold compound is for encapsulation of the semiconductor device package.Type: ApplicationFiled: November 4, 2020Publication date: May 5, 2022Inventors: Mohammad Waseem Hussain, David Taiwai Chin, Dorothy Lyou Mantle
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Publication number: 20210257282Abstract: A multi-chip module (MCM) package includes a leadframe including half-etched lead terminals including a full-thickness and half-etched portion, and second lead terminals including a thermal pad(s). A first die is attached by a dielectric die attach material to the half-etched lead terminals. The first die includes first bond pads coupled to first circuitry configured for receiving a control signal and for outputting a coded signal and a transmitter. The second die includes second bond pads coupled to second circuitry configured for a receiver with a gate driver. The second die is attached by a conductive die attach material to the thermal pad. Bond wires include die-to-die bond wires between a portion of the first and second bond pads. A high-voltage isolation device is between the transmitter and receiver. A mold compound encapsulates the first and the second die.Type: ApplicationFiled: February 17, 2021Publication date: August 19, 2021Inventors: Matthew David Romig, Wei Zhang, Mohammad Waseem Hussain, Peter Anthony Fundaro
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Publication number: 20200219798Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.Type: ApplicationFiled: March 18, 2020Publication date: July 9, 2020Inventors: Mohammad Waseem Hussain, Steven Murphy, Leslie E. Stark
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Patent number: 10636727Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.Type: GrantFiled: February 19, 2018Date of Patent: April 28, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Mohammad Waseem Hussain, Steven Murphy, Leslie E. Stark
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Publication number: 20190259685Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.Type: ApplicationFiled: February 19, 2018Publication date: August 22, 2019Inventors: Mohammad Waseem Hussain, Steven Murphy, Leslie E. Stark