Abstract: Various embodiments of a semiconductor chip device that include a circuit board and a stiffener frame and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a circuit board and coupling a stiffener frame to the circuit board. The stiffener frame includes a first opening that defines an interior wall. The interior wall includes a notch.

Abstract: Various embodiments of a semiconductor chip device that include a circuit board and a stiffener frame and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a circuit board and coupling a stiffener frame to the circuit board. The stiffener frame includes a first opening that defines an interior wall. The interior wall includes a notch.

Abstract: A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

Abstract: A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate; heating the flip chip die and the organic substrate to bond the flip chip die to the organic substrate, and cooling the flip chip die and the organic substrate. The step of heating the flux includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145° C. to about 165° C., soaking at a temperature of about 145° C. to about 165° C. for about four to about six minutes, and reflowing above the solder's melting point.

Abstract: A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.

Abstract: A boat is formed with layers comprising substantially aligned holes for safely accommodating land grid array semiconductor packages during assembly. The boat includes a bottom layer with an array of through-holes having a substantially square cross-sectional shape with rounded corners, a middle layer with an array of through-holes having a substantially octagonal cross-sectional shape and a top layer having an array of through-holes having a substantially square cross-sectional shape with notched sides and vertical tabs extending upwardly from the sidewalls of each notched side. The layers may be attached by spot welding or other means.

Abstract: A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

Abstract: A method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90.degree. C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.

Abstract: A memory configuration system including a memory controller comprising a set of memory configuration registers which store information related to memory devices installed in random access memory. The memory configuration registers correspond to one or more rows of memory banks in the random access memory. The memory controller also includes a row size and mask generator coupled to the memory configuration register set and a memory configuration decoder coupled to the row size and mask generator. The combination of logic within the row size and mask generator and the memory configuration decoder is used to generate a base address for each row of memory locations within the random access memory. The present invention automatically reconfigures the memory array to define the most populous row as Row 0 regardless of where the largest row is physically populated. This reconfiguration of the memory array is the logical to physical mapping feature provided by the present invention.