Patents by Inventor Mohammed Edris

Mohammed Edris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-volume on-wafer heterogeneous packaging of optical interconnects
    Patent number: 7767486
    Abstract: An optical connector module complete with optoelectronic devices, supporting integrated circuitry, and connector housing may be fabricated on a wafer level. A plurality of cavities may be formed on the backside of the wafer to accommodate an optoelectronic device. Active circuitry may be formed in a front side of the wafer. Through-vias electrically connect the front side to the back side. The backside of the wafer is overmolded with a polymer layer which when singulated into individual dies forms the plastic housing of an optical connector module.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: August 3, 2010
    Assignee: Intel Corporation
    Inventors: Mohammed Edris, Daoqiang Lu
  • HIGH-VOLUME ON-WAFER HETEROGENEOUS PACKAGING OF OPTICAL INTERCONNECTS
    Publication number: 20090129422
    Abstract: An optical connector module complete with optoelectronic devices supporting integrated circuitry, and connector housing may be fabricated on a wafer level. A plurality of cavities may be formed on the backside of the wafer to accommodate an optoelectronic device. Active circuitry may be formed in a front side of the wafer. Through-vias electrically connect the front side to the back side. The backside of the wafer is overmolded with a polymer layer which when singulated into individual dies forms the plastic housing of an optical connector module.
    Type: Application
    Filed: November 21, 2007
    Publication date: May 21, 2009
    Inventors: Mohammed Edris, Daoqiang Lu