Patents by Inventor Mohammed K. Ghazi

Mohammed K. Ghazi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ionized metal cluster beam systems and methods
    Patent number: 5331172
    Abstract: Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, multiple sources for depositing alloyed (tin-lead) bumps with constant composition, and single or multiple sources for directing a cluster beam through an aperture to deposit metal on a substrate and directing an ion beam at the aperture to remove metal deposited therein.
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: July 19, 1994
    Assignees: Microelectronics and Computer Technology Corporation, Hughes Aircraft Company
    Inventors: Nalin Kumar, Chenggang Xie, Rama R. Goruganthu, Mohammed K. Ghazi
  • Process for making semiconductor electrode bumps by metal cluster ion deposition and etching
    Patent number: 5290732
    Abstract: Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, and multiple sources for depositing alloyed (tin-lead) bumps with constant composition.
    Type: Grant
    Filed: June 9, 1992
    Date of Patent: March 1, 1994
    Assignees: Microelectronics And Computer Technology Corporation, Hughes Aircraft Company
    Inventors: Nalin Kumar, Chenggang Xie, Rama R. Goruganthu, Mohammed K. Ghazi
  • Method of making semiconductor bonding bumps using metal cluster ion deposition
    Patent number: 5156997
    Abstract: A method of making bonding bumps on the pads of an electrical chip including depositing a layer of metallic adhesion material over the surface, depositing metallic bumps on the metallic adhesion material over each of the pad areas using a focused liquid metal ion source, and chemically etching the layer of metallic adhesion material off the surface outside of the deposited bumps.
    Type: Grant
    Filed: February 11, 1991
    Date of Patent: October 20, 1992
    Assignees: Microelectronics and Computer Technology Corporation, Hughes Aircraft Company
    Inventors: Nalin Kumar, Rama R. Goruganthu, Mohammed K. Ghazi