Abstract: An accelerator circuit is provided that includes an inverter chain having an input coupled to a data line and a sense circuit having inputs coupled to an output of the inverter chain and the data line. The sense circuit is configured to sense a rise toward a supply voltage on the data line or a fall toward a ground voltage on the data line. The accelerator circuit further includes an amplify circuit having inputs coupled to outputs of the sense circuit and an output coupled to the data line, where the amplify circuit is configured to amplify the data line toward the supply voltage or toward the ground voltage based on amplify enable signals output by the sense circuit.

Abstract: An accelerator circuit is provided that includes an inverter chain having an input coupled to a data line and a sense circuit having inputs coupled to an output of the inverter chain and the data line. The sense circuit is configured to sense a rise toward a supply voltage on the data line or a fall toward a ground voltage on the data line. The accelerator circuit further includes an amplify circuit having inputs coupled to outputs of the sense circuit and an output coupled to the data line, where the amplify circuit is configured to amplify the data line toward the supply voltage or toward the ground voltage based on amplify enable signals output by the sense circuit.

Abstract: A memory cell array includes local input/output logic configured to access memory cells in memory banks. The memory cell array includes inner memory banks disposed in either direction from the local input/output logic. The memory cell array includes outer memory banks disposed beyond the inner memory banks in either direction from the local input/output logic. The memory cell array further includes local bitlines that run in a lower metallization layer of each of the memory banks. The local bitlines of the outer memory banks connect to the local input/output logic via an upper metallization layer across regions of the inner memory banks.

Abstract: A memory cell array includes local input/output logic configured to access memory cells in memory banks. The memory cell array includes inner memory banks disposed in either direction from the local input/output logic. The memory cell array includes outer memory banks disposed beyond the inner memory banks in either direction from the local input/output logic. The memory cell array further includes local bitlines that run in a lower metallization layer of each of the memory banks. The local bitlines of the outer memory banks connect to the local input/output logic via an upper metallization layer across regions of the inner memory banks.

Abstract: Static random access memory (SRAM) cells are disclosed. In one example embodiment the SRAM cell includes a latch having a first node and a second node for storing bit information at the first node and a complement of the bit at the second node. The SRAM cell further includes a first switch controlled by a write operation signal, connected between a supply voltage and a first pull-up transistor of the latch and a third switch controlled the write operation signal, connected between the second node and a ground voltage. The SRAM cell further includes a second switch controlled by the write operation signal, connected between the supply voltage and a second pull-up transistor and a fourth switch controlled by the write operation signal, connected between the second node and the ground voltage. The write operation signals are generated by a first complex gate and a second complex gate.

Abstract: Static random access memory (SRAM) cells are disclosed. In one example embodiment the SRAM cell includes a latch having a first node and a second node for storing bit information at the first node and a complement of the bit at the second node. The SRAM cell further includes a first switch controlled by a write operation signal, connected between a supply voltage and a first pull-up transistor of the latch and a third switch controlled the write operation signal, connected between the second node and a ground. The SRAM cell further includes a second switch controlled by the write operation signal, connected between the supply voltage and a second pull-up transistor and a fourth switch controlled by the write operation signal, connected between the second node and the ground. The write operation signals are generated by a first complex gate and a second complex gate.