Abstract: A method for electroless deposition of aluminum or an aluminum alloy on a substrate surface is provided. The method includes activating the surface of the substrate to be coated by applying a coating of a catalyst metal; preparing a mixture of urea (NH2CONH2) and anhydrous aluminum chloride (AlCl3) having a 2:1 molar ratio of AlCl3:NH2CONH2 to obtain a Lewis acid room temperature ionic liquid (RTIL) optionally containing an alloy metal salt; dissolving a hydride reducing agent in an aprotic anhydrous solvent to obtain a hydride solution; mixing the hydride solution and the AlCl3:NH2CONH2 RTIL to obtain an electroless Al solution; exposing the activated surface of the substrate to the electroless Al solution; and removing the electroless Al solution from the substrate surface; wherein upon exposure of the activated substrate surface to the electroless Al solution, an Al or Al alloy coating is obtained on the activated substrate surface.

Abstract: A method for electroless deposition of aluminum or an aluminum alloy on a substrate surface. The method includes activating the surface of the substrate to be coated by applying a coating of a catalyst metal; preparing a mixture of urea ((NH2CONH2) and anhydrous aluminum chloride (AlCl3) wherein a molar ratio of AlCl3:(NH2CONH2 is greater than 1:1 to obtain a Lewis acid room temperature ionic liquid (RTIL) optionally containing an alloy metal salt; dissolving a hydride reducing agent in an aprotic anhydrous solvent to obtain a hydride solution; mixing the hydride solution and the AlCl3:(NH2CONH2 RTIL to obtain an electroless Al solution; exposing the activated surface of the substrate to the electroless Al solution; and removing the electroless Al solution from the substrate surface; wherein upon exposure of the activated substrate surface to the electroless Al solution, an Al or Al alloy coating is obtained on the activated substrate surface.