Patents by Inventor Mohan Mahadevan

Mohan Mahadevan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220351532
    Abstract: Described are methods and systems for detecting fraud in documents. First images of a first set of genuine documents and second images of a second set of genuine documents are obtained. A printed feature, spacings between printed features in the first images, and positions of printed features in the second images are selected. Selected features, spacings and positions are annotated to obtain original landmark locations for each printed feature, spacing and position. Annotated features, spacings and positions are transformed to obtain transformed features, transformed spacings and transformed positions. The transformed features, spacings and positions are combined with a noise model to generate modified features, modified spacings and modified positions. Each modified feature, modified spacing and modified position comprises annotations indicating modified landmark locations. Input data for a machine learning model is generated using original landmark locations and modified landmark locations.
    Type: Application
    Filed: April 12, 2022
    Publication date: November 3, 2022
    Inventors: Jochem Gietema, Mohan Mahadevan, Roberto Annunziata, Pieter-jan Reynaert, Elizaveta Ivanova, Yuanwei Li, Tal Shaharabany, Shachar Ben Dayan, Erez Farhan, Francesco Picciotti
  • Patent number: 11237872
    Abstract: Real-time job distribution software architectures for high bandwidth, hybrid processor computation systems for semiconductor inspection and metrology are disclosed. The imaging processing computer architecture can be scalable by changing the number of CPUs and GPUs to meet computing needs. The architecture is defined using a master node and one or more worker nodes to run image processing jobs in parallel for maximum throughput. The master node can receive input image data from a semiconductor wafer or reticle. Jobs based on the input image data are distributed to one of the worker nodes. Each worker node can include at least one CPU and at least one GPU. The image processing job can contain multiple tasks, and each of the tasks can be assigned to one of the CPU or GPU in the worker node using a worker job manager to process the image.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: February 1, 2022
    Assignee: KLA-TENCOR CORPORATION
    Inventors: Ajay Gupta, Sankar Venkataraman, Sashi Balasingam, Mohan Mahadevan
  • Publication number: 20210343030
    Abstract: A computer-implemented method for extracting information from a document, for example an official document, is disclosed. The method comprises acquiring an input image comprising a document portion; performing image segmentation on the input image to form a binary input image that distinguishes the document portion from the remaining portion of the input image; estimating a first image transform to align the binary input image to a binary template image, using the first image transform on the input image to form an intermediate image; estimating a second image transform to align the intermediate image to a template image; using the second image transform on the intermediate image to form an output image; and extracting a field from the output image using a predetermined field of the template image.
    Type: Application
    Filed: April 28, 2021
    Publication date: November 4, 2021
    Applicant: ONFIDO LTD
    Inventors: Christos Sagonas, Karolina Dabkowska, Zhiyuan Shi, Edward Fleri Soler, Mohan Mahadevan, Iona Grace Vincent, Luca Peric, Alessandro Lenzi, Alvaro Fernando Lara, James Stonehill
  • Patent number: 11123944
    Abstract: Dunnage may be applied to surfaces of items by nozzles coupled to one or more robotic arms that may be operated in six degrees of freedom within three-dimensional space. The dunnage is applied in substantially hollow pieces or sections by one or more 3D printing processes, e.g., by deposition. Such pieces or sections may be applied in one or more series or patterns along surfaces of an item prior to enveloping the item in one or more wraps or covers, or depositing the item in one or more containers. Various characteristics of the dunnage, such as materials from which the dunnage is formed, diameters or thicknesses of the dunnage, the series or patterns in which the dunnage is applied to the surface of the item, or any other factors may be selected based on one or more attributes of the items, such as dimensions or shipping and handling instructions.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: September 21, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Brian Hoffman, Alexandra Hartford, Mohan Mahadevan, John Matrecano, Timothy Talda
  • Publication number: 20210125104
    Abstract: The present invention relates to a machine learning inference system and processing modules thereof. In particular, the present invention relates to a machine learning inference system, a confidence module, a data minder module, a data remapping module, an adversarial defense module, and an update module. The machine learning inference system and processing modules thereof are useful for mission-critical applications to increase and maintain performance of a machine learning model.
    Type: Application
    Filed: October 20, 2020
    Publication date: April 29, 2021
    Applicant: ONFIDO LTD
    Inventors: Lewis Carl Christiansen, Zhiyuan Shi, Romain Raymond Jackie Sabathé, Philip Samuël Botros, Jochem Gietema, Pieter-Jan Louis Christianne Reynaert, Sophie Dermaux, Karolina Dabkowska, Daniele Pizzocchero, Pouria Mortazavian, Mohan Mahadevan
  • Patent number: 10967995
    Abstract: A package preparation system includes a material conveyable along a longitudinal direction and including two folded layers of polymeric film joined at a fold. The fold extends longitudinally and defines a first side of the material opposite an open second side. A first welding device forms partition welds located between the two folded layers and extending from the fold to a terminus inward of the open side. A second welding device forms first and second seal welds that extend from the fold to the open side and are spaced from each other by a length extending longitudinally and traversing a plurality of the partition welds. The system includes a device comprising a nozzle insertable in the open side, and clamps that traverse the length and temporarily seal the open side around the nozzle while the nozzle inflates interior channels defined between the plurality of partition welds.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: April 6, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Brian Hoffman, Alexandra Kay Hartford, Mohan Mahadevan, John Gaetano Matrecano, Timothy Alan Talda
  • Patent number: 10769761
    Abstract: Methods and systems for generating a high resolution image for a specimen from a low resolution image of the specimen are provided. One system includes one or more computer subsystems configured for acquiring a low resolution image of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a deep convolutional neural network that includes one or more first layers configured for generating a representation of the low resolution image. The deep convolutional neural network also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the low resolution image. The second layer(s) include a final layer configured to output the high resolution image and configured as a sub-pixel convolutional layer.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: September 8, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Saurabh Sharma, Amitoz Singh Dandiana, Mohan Mahadevan, Chao Fang, Amir Azordegan, Brian Duffy
  • Patent number: 10733744
    Abstract: Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: August 4, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Thanh Huy Ha, Scott A. Young, Mohan Mahadevan
  • Patent number: 10669054
    Abstract: An actuator system for fabricating a cavity within thermoplastic material includes a plurality of actuators arranged in an array. When dimensions of an item are determined, the actuator system may be programmed with data regarding such dimensions to fabricate a cavity for the item. A subset of the actuators, and distances by which each of the actuators is to be extended, may be selected based on dimensions of the item, in order to fabricate a cavity within the thermoplastic material that may accommodate the item therein. Additionally, the actuators and the distances may be selected based on intrinsic or extrinsic data regarding the item, and a cavity fabricated within the thermoplastic material may include one or more buffer zones or protective regions that are specifically formed with respect to aspects of the item.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: June 2, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Brian Hoffman, Cory Richard Boudreau, Todd Ethan Brunner, David C. Franchino, Alexandra Kay Hartford, Vivian Lin, Mohan Mahadevan, John Gaetano Matrecano, Alexandra Surasky-Ysasi, Timothy Alan Talda
  • Patent number: 10607119
    Abstract: Methods and systems for detecting and classifying defects on a specimen are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a neural network configured for detecting defects on a specimen and classifying the defects detected on the specimen. The neural network includes a first portion configured for determining features of images of the specimen generated by an imaging subsystem. The neural network also includes a second portion configured for detecting defects on the specimen based on the determined features of the images and classifying the defects detected on the specimen based on the determined features of the images.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: March 31, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Li He, Mohan Mahadevan, Sankar Venkataraman, Huajun Ying, Hedong Yang
  • Patent number: 10605744
    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: March 31, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
  • Patent number: 10533954
    Abstract: Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: January 14, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Lena Nicolaides, Mohan Mahadevan, Alex Salnik, Scott A. Young
  • Patent number: 10395362
    Abstract: Methods and systems for detecting defects in patterns formed on a specimen are provided. One system includes one or more components executed by one or more computer subsystems, and the component(s) include first and second learning based models. The first learning based model generates simulated contours for the patterns based on a design for the specimen, and the simulated contours are expected contours of a defect free version of the patterns in images of the specimen generated by an imaging subsystem. The second learning based model is configured for generating actual contours for the patterns in at least one acquired image of the patterns formed on the specimen. The computer subsystem(s) are configured for comparing the actual contours to the simulated contours and detecting defects in the patterns formed on the specimen based on results of the comparing.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: August 27, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Ajay Gupta, Mohan Mahadevan, Sankar Venkataraman, Hedong Yang, Laurent Karsenti, Yair Carmon, Noga Bullkich, Udy Danino
  • Patent number: 10360477
    Abstract: Methods and systems for performing one or more functions for a specimen using output simulated for the specimen are provided. One system includes one or more computer subsystems configured for acquiring output generated for a specimen by one or more detectors included in a tool configured to perform a process on the specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a learning based model configured for performing one or more first functions using the acquired output as input to thereby generate simulated output for the specimen. The one or more computer subsystems are also configured for performing one or more second functions for the specimen using the simulated output.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: July 23, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Kris Bhaskar, Scott Young, Mark Roulo, Jing Zhang, Laurent Karsenti, Mohan Mahadevan, Bjorn Brauer
  • Patent number: 10290088
    Abstract: Methods and systems for monitoring process tool conditions are disclosed. The method combines single wafer, multiple wafers within a single lot and multiple lot information together statistically as input to a custom classification engine that can consume single or multiple scan, channel, wafer and lot to determine process tool status.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: May 14, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Himanshu Vajaria, Tommaso Torelli, Bradley Ries, Mohan Mahadevan
  • Publication number: 20190073568
    Abstract: Methods and systems for detecting and classifying defects on a specimen are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a neural network configured for detecting defects on a specimen and classifying the defects detected on the specimen. The neural network includes a first portion configured for determining features of images of the specimen generated by an imaging subsystem. The neural network also includes a second portion configured for detecting defects on the specimen based on the determined features of the images and classifying the defects detected on the specimen based on the determined features of the images.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 7, 2019
    Inventors: Li He, Mohan Mahadevan, Sankar Venkataraman, Huajun Ying, Hedong Yang
  • Publication number: 20190005629
    Abstract: Methods and systems for generating a high resolution image for a specimen from a low resolution image of the specimen are provided. One system includes one or more computer subsystems configured for acquiring a low resolution image of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a deep convolutional neural network that includes one or more first layers configured for generating a representation of the low resolution image. The deep convolutional neural network also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the low resolution image. The second layer(s) include a final layer configured to output the high resolution image and configured as a sub-pixel convolutional layer.
    Type: Application
    Filed: June 26, 2018
    Publication date: January 3, 2019
    Inventors: Saurabh Sharma, Amitoz Singh Dandiana, Mohan Mahadevan, Chao Fang, Amir Azordegan, Brian Duffy
  • Publication number: 20180341525
    Abstract: Real-time job distribution software architectures for high bandwidth, hybrid processor computation systems for semiconductor inspection and metrology are disclosed. The imaging processing computer architecture can be scalable by changing the number of CPUs and GPUs to meet computing needs. The architecture is defined using a master node and one or more worker nodes to run image processing jobs in parallel for maximum throughput. The master node can receive input image data from a semiconductor wafer or reticle. Jobs based on the input image data are distributed to one of the worker nodes. Each worker node can include at least one CPU and at least one GPU. The image processing job can contain multiple tasks, and each of the tasks can be assigned to one of the CPU or GPU in the worker node using a worker job manager to process the image.
    Type: Application
    Filed: May 14, 2018
    Publication date: November 29, 2018
    Inventors: Ajay Gupta, Sankar Venkataraman, Sashi Balasingam, Mohan Mahadevan
  • Publication number: 20180330511
    Abstract: Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.
    Type: Application
    Filed: March 20, 2018
    Publication date: November 15, 2018
    Inventors: Thanh Huy Ha, Scott A. Young, Mohan Mahadevan
  • Publication number: 20180293721
    Abstract: Methods and systems for detecting defects in patterns formed on a specimen are provided. One system includes one or more components executed by one or more computer subsystems, and the component(s) include first and second learning based models. The first learning based model generates simulated contours for the patterns based on a design for the specimen, and the simulated contours are expected contours of a defect free version of the patterns in images of the specimen generated by an imaging subsystem. The second learning based model is configured for generating actual contours for the patterns in at least one acquired image of the patterns formed on the specimen. The computer subsystem(s) are configured for comparing the actual contours to the simulated contours and detecting defects in the patterns formed on the specimen based on results of the comparing.
    Type: Application
    Filed: February 14, 2018
    Publication date: October 11, 2018
    Inventors: Ajay Gupta, Mohan Mahadevan, Sankar Venkataraman, Hedong Yang, Laurent Karsenti, Yair Carmon, Noga Bullkich, Udy Danino