Abstract: A process of forming an array of monolithically integrated thin film photovoltaic cells from a stack of thin film layers formed on an insulating substrate includes forming at least one cell isolation scribe in the stack of thin film layers. A second electrical contact layer isolation scribe is formed for each cell isolation scribe adjacent to a respective cell isolation scribe. A via scribe is formed in the stack of thin film layers between each cell isolation scribe and its respective second electrical contact layer isolation scribe. Insulating ink is disposed in each cell isolation scribe, and conductive ink is disposed in each via scribe to form a via. Conductive ink is also disposed along the top surface of the stack of thin film layers to form at least one conductive grid.

Abstract: A process of forming an array of monolithic ally integrated thin film photo voltaic cells from a stack of thin film layers formed on an insulating substrate includes forming at least one cell isolation scribe in the stack of thin film layers. A second electrical contact layer isolation scribe is formed for each cell isolation scribe adjacent to a respective cell isolation scribe. A via scribe is formed in the stack of thin film layers between each cell isolation scribe and its respective second electrical contact layer isolation scribe. Insulating ink is disposed in each cell isolation scribe, and conductive ink is disposed in each via scribe to form a via. Conductive ink is also disposed along the top surface of the stack of thin film layers to form at least one conductive grid.

Abstract: A clinical grid electrode system for seizure control through local cooling, mapping brain function and me provision of reversible functional ablation. The system includes a modular, scalable, cooling and sensing array composed of a plurality of cooling sensing elements. The system also includes a control system to which die cooling and sensing array is coupled for providing for control and monitoring of die cooling sensing elements making up the cooling and sensing array.

Abstract: A clinical grid electrode system for seizure control through local cooling, mapping brain function and me provision of reversible functional ablation. The system includes a modular, scalable, cooling and sensing array composed of a plurality of cooling sensing elements. The system also includes a control system to which die cooling and sensing array is coupled for providing for control and monitoring of die cooling sensing elements making up the cooling and sensing array.

Abstract: A process of forming an array of monolithic ally integrated thin film photo voltaic cells from a stack of thin film layers formed on an insulating substrate includes forming at least one cell isolation scribe in the stack of thin film layers. A second electrical contact layer isolation scribe is formed for each cell isolation scribe adjacent to a respective cell isolation scribe. A via scribe is formed in the stack of thin film layers between each cell isolation scribe and its respective second electrical contact layer isolation scribe. Insulating ink is disposed in each cell isolation scribe, and conductive ink is disposed in each via scribe to form a via. Conductive ink is also disposed along the top surface of the stack of thin film layers to form at least one conductive grid.

Abstract: A process of forming an array of monolithically integrated thin film photovoltaic cells from a stack of thin film layers formed on an insulating substrate includes forming at least one cell isolation scribe in the stack of thin film layers. A second electrical contact layer isolation scribe is formed for each cell isolation scribe adjacent to a respective cell isolation scribe. A via scribe is formed in the stack of thin film layers between each cell isolation scribe and its respective second electrical contact layer isolation scribe. Insulating ink is disposed in each cell isolation scribe, and conductive ink is disposed in each via scribe to form a via. Conductive ink is also disposed along the top surface of the stack of thin film layers to form at least one conductive grid.

Abstract: A method of manufacture of CIGS photovoltaic cells and modules involves sequential deposition of copper indium gallium diselenide compounds in multiple thin sublayers to form a composite CIGS absorber layer of a desirable thickness greater than the thickness of each sublayer. In an embodiment, the method is adapted to roll-to-roll processing of CIGS PV cells. In an embodiment, the method is adapted to preparation of a CIGS absorber layer having graded composition through the layer. In a particular embodiment, the graded composition is enriched in copper at a base of the layer. In an embodiment, each CIGS sublayer is deposited by co-evaporation of copper, indium, gallium, and selenium which react in-situ to form CIGS.

Abstract: A method of manufacture of CIGS photovoltaic cells and modules involves sequential deposition of copper indium gallium diselenide compounds in multiple thin sublayers to form a composite CIGS absorber layer of a desirable thickness greater than the thickness of each sublayer. In an embodiment, the method is adapted to roll-to-roll processing of CIGS PV cells. In an embodiment, the method is adapted to preparation of a CIGS absorber layer having graded composition through the layer. In a particular embodiment, the graded composition is enriched in copper at a base of the layer. In an embodiment, each CIGS sublayer is deposited by co-evaporation of copper, indium, gallium, and selenium which react in-situ to form CIGS.

Abstract: A process of forming an array of monolithically integrated thin film photovoltaic cells from a stack of thin film layers formed on an insulating substrate includes forming at least one cell isolation scribe in the stack of thin film layers. A second electrical contact layer isolation scribe is formed for each cell isolation scribe adjacent to a respective cell isolation scribe. A via scribe is formed in the stack of thin film layers between each cell isolation scribe and its respective second electrical contact layer isolation scribe. Insulating ink is disposed in each cell isolation scribe, and conductive ink is disposed in each via scribe to form a via. Conductive ink is also disposed along the top surface of the stack of thin film layers to form at least one conductive grid.

Abstract: An electronic circuit assembly includes a printed circuit board having a plurality of conductors formed thereon. An integrated circuit die is mounted directly on and bonded to the circuit board. A plurality of microleads extend between the integrated circuit die and conductors and are ultrasonically bonded to the die and conductors. A protective coating deposited on the circuit board encapsulates the circuit die and microleads. Methods for depositing the coating include flow and cure, immersion and plasma spray techniques.

Abstract: A cellulosic substrate is impregnated using a plasma gun. A plasma spray of a ceramic material is applied to a first surface of the cellulosic substrate. The ceramic material improves various properties of the first surface of the cellulosic substrate.

Abstract: A pliant, controllable contour control surface comprising a first flexible facesheet formed to a first initial contour of the control surface, and a second flexible facesheet formed to a second initial contour of the control surface. The first and second facesheets each have a set of prestrained shape memory alloy tendons embedded therein, extending from a leading edge to a trailing edge of the control surface. Each set of the shape memory alloy tendons is separately connected to a controlled source of electrical current such that tendons of the first and second flexible facesheets can be selectively heated in an antagonistic, slack-free relationship, to bring about a desired modification of the configuration of the control surface. A computer based control system is utilized for maintaining a constant temperature of the antagonists to establish conditions conducive to the stress induced transformation from austenite to martensite, accomplished by causing constant current to flow through the antagonists.

Abstract: A process for reducing high temperature oxidation of graphite electrodes for steel making by coating the electrodes with a siloxane fluid, such as dimethylpolysiloxane. Silicon carbide particles can be suspended in the siloxane fluid to improve coating characteristics.