Abstract: A method of automatically placing transistors of a folded transistor circuit for synthesizing rows of transistors in a semiconductor layout (172). First, an initial placement of transistors is generated (802). Next, a candidate move of transistors is selected (804). Then the change in cost of the placement resulting from applying the candidate move is evaluated (806). A decision is made to accept the candidate move based on the evaluation of its cost (808). If accepted, the move is performed (810) and the cost of the placement is updated (812). Finally, a decision to terminate the process is made (814).

Abstract: A method for optimizing contact pin placement in an integrated circuit, wherein a netlist containing connectivity information, and placement information for a semiconductor circuit is read. Each net in the circuit is classified (510). Unblocked tracks are identified for each net in the circuit (512). All contact pins associated with nets having a power supply classification are placed according to a power supply location (513). The blockage for each remaining net is updated. Next, all contact pins for nets residing within a defined diffusion are placed (514) The blockage for each remaining net is updated. Next, all contact pins for nets residing in multiple defined diffusion areas are placed (515).

Abstract: A method for automatically selecting tie styles used during the horizontal placement of substrate and well ties. A linear order of tie styles is determined (2422). Ties are placed horizontally in the layout based upon an initial tie style (2424). Route and compact layout components (2426). If the layout has satisfied the tie coverage rules (2428) the tie style selection process is complete. Otherwise, contacts, vias and ties are added where possible (2430). If the layout has now satisfied the tie coverage rules (2432) tie style selection process is complete. If not, the next tie style is chosen from the linear order (2434). The process continues by placing (2424), routing and compacting components (2426) with the new tie style, until the cell satisfies the tie coverage rules.

Abstract: A method of interconnecting transistors and other devices in order to optimize area of a layout of a cell while honoring performance constraints (1502) and enhancing yield starts with a prerouting step (152) that routes adjacent transistors using diffusion wiring (1506), routes power and ground nets (1508), routes aligned gates (1510), routes all remaining aligned source/drain nets as well as any special nets (1512). Next, all of the remaining nets are routed using an area based router (1408). Nets are order based on time criticality or net topology (1602). A routing grid is assigned for all the layers to be used in routing (1604). An initial coarse routing is performed (1606). Wire groups are assigned to routing layers (1608). Routing is improved and vias are minimized (1610). A determination is then made whether the routing solution is acceptable (1612). If the routintg solution is not acceptable, the routing space is expanded and routing costs and via costs are modifyied to improve the routing solution.

Abstract: The present invention relates to a method (100, 150, 200) and associated data processing system (250) for determining a standard cell height within an integrated circuit design. A plurality of cell types, each cell type including a plurality of cell structures are received (102). Then, weighting values are received, one for each cell type (104). Expected intercell connection densities are preferably also received. Various target cell heights are processed with the plurality of cell types, the weighting values, and the expected intercell connection densities to generate a standard cell height (106). The standard cell height used with the integrated circuit design produces an optimized integrated circuit area, preferably a minimum area. The present invention includes a method (200) and system (250) for selecting an optimized standard cell height that, when used with a place-and-route tool to generate a physical design file (204) produces an optimized physical integrated circuit design.

Abstract: A method for designing an integrated circuit involves a four step process. First, a behavioral circuit model (BCM) is read which contains assignment statements which identify the logical operation of an integrated circuit (IC). The BCM is translated to a data file which described a plurality of interconnected logic gate functions to duplicate the operation of the BCM. The gates in the data file are then assigned a specific Vdd and ground rail size, a specific drive strength for speed considerations, and a cell pitch or height to optimize physical layout, in any order. The result in a physical design file which may be used to form masks and integrated circuits having optimized speed and optimized circuit area in a short design cycle.