Abstract: A method including electrodepositing a metal layer on a contact pad of a circuit, wherein the metal layer protrudes from the contact pad and has a width dimension greater than a width dimension of the pad. A method including forming a first layer on a contact pad in a contact opening in a dielectric layer; and electrodepositing a second layer directly on the first layer, the electrodepositing being of sufficient duration to protrude from the contact opening. An apparatus including an integrated circuit comprising a plurality of contact pads formed in contact openings in a dielectric material on the surface of the integrated circuit; and an electrodeposited layer formed individually each of the plurality of contact pads, each electrodeposited layer extending from the respective contact opening.

Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a solder bump that is disposed upon the lower surface. The stress-relief layer flows against the solder bump. An article that exhibits a stress-relief layer with a structure characteristic of the manner of dispensing is also included. A computing system that includes a stress-relief layer with a structure characteristic of the manner of dispensing is also included.