Abstract: Integrated circuit packages having shared die-to-die contacts and methods to fabricate the same are disclosed. A disclosed example integrated circuit package comprises a leadframe, a first die pad and a second die pad associated with the leadframe, and first and second integrated circuits associated with the first and second die pads, respectively. The package also includes a shared die-to-die contact externally exposed by a recess that extends laterally across a bottom surface of the leadframe between the first and second die pads. The first integrated circuit is electrically coupled to a first portion of the shared contact. The second integrated circuit is electrically coupled to a second portion of the shared contact.

Abstract: A method and system for deflashing mold compound is provided. In one embodiment, a method for dislodging contaminants from an integrated circuit includes directing sublimating particles against a surface of the integrated circuit. Contaminants disposed on the surface of the integrated circuit are abraded with the sublimating particles to dislodge at least a portion of the contaminants.