Patents by Inventor Mohd Helmy Bin Ahmad

Mohd Helmy Bin Ahmad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system including ribbon bond interconnect
    Patent number: 7443018
    Abstract: An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: October 28, 2008
    Assignees: Stats Chippac Ltd., Orthodyne Electronics Corporation
    Inventors: You Yang Ong, Kwang Yong Chung, Mohd Helmy Bin Ahmad, Garrett L. Wong, Christoph B. Luechinger