Patents by Inventor Mohee Sagae
Mohee Sagae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12194650Abstract: The handpiece-type high-frequency vibration apparatus includes a roughly cylindrical housing 10 configuring a handpiece, a holding member 11, a tool 12, a controller 20 and an excitation device 21. In a non-contact state before the tool 12 is brought into contact with an object, the controller 20 drives the excitation device 21 so as to vibrate the tool 12 at an added frequency fp for which a predetermined frequency fs is added to a first resonance frequency fr1 of the tool 12. In a cutting state where the tool 12 is in contact with the object by a load that enables cutting of the object by the tool 12, the controller 20 controls drive of the excitation device 21 such that a third resonance frequency fr3 of the tool 12 increases and coincides with the added frequency fp, and increases a vibration frequency of the tool 12.Type: GrantFiled: April 22, 2020Date of Patent: January 14, 2025Assignee: Micron Machinery Co., Ltd.Inventors: Jinzo Yabe, Mohee Sagae, Satoshi Kobayashi, Yoshihiro Minagawa
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Patent number: 11523878Abstract: A handpiece-type high-frequency vibration cutting device includes a housing (10); a vibration device (21); a holding member (11); a tool (12); and a controller (20) to control the operations of the vibration device (21). The controller (20) controls the vibration of the tool (12) due to the vibration device (21) such that the vibration is burst oscillation in which vibration and stop of vibration are repeated. The controller (20) also controls the entire burst frequency f1 of the tool (12) to be included in the range of 1 to 8 [Hz], one cycle of the burst frequency f1 including a burst period with the holding member (11) vibrating and a stop period with the tool (12) not vibrating. The controller (20) also controls the vibration frequency f2 of the tool (12) during the burst period such that the vibration frequency f2 is in the range of 20 to 60 [kHz].Type: GrantFiled: September 21, 2018Date of Patent: December 13, 2022Assignee: Micron Machinery Co., Ltd.Inventors: Mohee Sagae, Satoshi Kobayashi, Yoshihiro Minagawa, Hiroki Suzuki, Norihiko Nakajima
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Publication number: 20220227017Abstract: The handpiece-type high-frequency vibration apparatus includes a roughly cylindrical housing 10 configuring a handpiece, a holding member 11, a tool 12, a controller 20 and an excitation device 21. In a non-contact state before the tool 12 is brought into contact with an object, the controller 20 drives the excitation device 21 so as to vibrate the tool 12 at an added frequency fp for which a predetermined frequency fs is added to a first resonance frequency fr1 of the tool 12. In a cutting state where the tool 12 is in contact with the object by a load that enables cutting of the object by the tool 12, the controller 20 controls drive of the excitation device 21 such that a third resonance frequency fr3 of the tool 12 increases and coincides with the added frequency fp, and increases a vibration frequency of the tool 12.Type: ApplicationFiled: April 22, 2020Publication date: July 21, 2022Inventors: Jinzo YABE, Mohee SAGAE, Satoshi KOBAYASHI, Yoshihiro MINAGAWA
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Patent number: 11052508Abstract: When a work W rotates counterclockwise about an axis Ow and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O1 and a grinding wheel (2) which rotates clockwise about an axis O2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S1 and a second stress sensor S2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.Type: GrantFiled: September 21, 2018Date of Patent: July 6, 2021Assignee: Micron Machinery Co., Ltd.Inventors: Mohee Sagae, Satoshi Kobayashi, Katsuyuki Takeda
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Publication number: 20200214795Abstract: A handpiece-type high-frequency vibration cutting device includes a housing (10); a vibration device (21); a holding member (11); a tool (12); and a controller (20) to control the operations of the vibration device (21). The controller (20) controls the vibration of the tool (12) due to the vibration device (21) such that the vibration is burst oscillation in which vibration and stop of vibration are repeated. The controller (20) also controls the entire burst frequency f1 of the tool (12) to be included in the range of 1 to 8 [Hz], one cycle of the burst frequency f1 including a burst period with the holding member (11) vibrating and a stop period with the tool (12) not vibrating. The controller (20) also controls the vibration frequency f2 of the tool (12) during the burst period such that the vibration frequency f2 is in the range of 20 to 60 [kHz].Type: ApplicationFiled: September 21, 2018Publication date: July 9, 2020Inventors: Mohee SAGAE, Satoshi KOBAYASHI, Yoshihiro MINAGAWA, Hiroki SUZUKI, Norihiko NAKAJIMA
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Publication number: 20190091831Abstract: When a work W rotates counterclockwise about an axis Ow and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O1 and a grinding wheel (2) which rotates clockwise about an axis O2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S1 and a second stress sensor S2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.Type: ApplicationFiled: September 21, 2018Publication date: March 28, 2019Inventors: Mohee SAGAE, Satoshi KOBAYASHI, Katsuyuki TAKEDA
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Publication number: 20160059372Abstract: Some implementations of the described invention provide an improved centerless grinding apparatus in which grinding is efficiently operated by reducing the idle time of the grinding wheel. While the described apparatus can comprise any suitable feature, in some cases, it includes a first regulating wheel and a second regulating wheel are axially aligned side by side. In some cases, a first grinding area is provided between the first regulating wheel and a first blade. In some cases, a second grinding area is provided between the second regulating wheel and a second blade. Additionally, in some cases, a grinding wheel is mounted on a grinding wheel Z-slide to be moved reciprocatively between the first grinding area and the second grinding area. In this way, grinding is efficiently operated by reducing the idle time of the grinding wheel.Type: ApplicationFiled: August 29, 2014Publication date: March 3, 2016Applicant: Micron Machinery Co., LtdInventors: Mohee Sagae, Fumio Takase, Tomihiko Hasumi, Hidenori Saito
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Patent number: 7037176Abstract: In centerless grinding there are the in-feed and the through-feed scheme, each having their respective advantages and disadvantages. When a work being machined by centerless grinding has plural portions being machined, those portions can be distinguished as portions being machined suitable for in-feed and portions being machined suitable for through-feed. Then, the present invention, using the same centerless machine, performs through-feed grinding in the first half of the process, then automatically switches from that and performs in-feed grinding in the latter half of the process. Thus, in a single piece of work being machined, sites suited to through-feed grinding are subjected to through-feed grinding, and sites suited to in-feed grinding are subjected to in-feed grinding. Not only so, but it is unnecessary to alter the setup between the first half of the process and the latter half of the process, wherefore centerless grinding can be performed very efficiently.Type: GrantFiled: February 4, 2002Date of Patent: May 2, 2006Assignees: Denso Corporation, Micron Machinery Co., Ltd.Inventors: Yukio Yamaguchi, Mohee Sagae
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Publication number: 20020115391Abstract: In centerless grinding there are the in-feed and the through-feed scheme, each having their respective advantages and disadvantages.Type: ApplicationFiled: February 4, 2002Publication date: August 22, 2002Inventors: Yukio Yamaguchi, Mohee Sagae
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Patent number: 6083084Abstract: Machining apparatus for machining a workpiece with a machining tool, including a work holder for holding the workpiece, and a cold gas stream supply device including a cooling gas nozzle through which a cold gas stream is supplied to a machining point, and wherein the cooling gas nozzle is provided on the work holder, and the cold gas stream has a temperature lower than an ambient temperature of the apparatus. The apparatus may be a centerless grinding apparatus including a regulating wheel for rotating the workpiece, and a work rest blade cooperating with the regulating wheel to rotatably support the workpiece so that the workpiece is ground by a grinding wheel while the workpiece is held by the work holder between the regulating and grinding wheels. The cooling gas nozzle is desirably positioned such that a distance between the exit end of the cooling gas nozzle and the grinding point is not larger than a diameter of the workpiece.Type: GrantFiled: September 2, 1998Date of Patent: July 4, 2000Assignee: Toyota Jidosha Kabushiki KaishaInventors: Kazuhiko Yokogawa, Shuji Yamamoto, Katsuhiko Hashizume, Masaaki Sato, Tokufumi Takeuchi, Mohee Sagae, Masayuki Kuwata, Satoshi Ebina